TY  - JOUR
U1  - Zeitschriftenartikel, wissenschaftlich - begutachtet (reviewed)
A1  - Stroj, Sandra
A1  - Plank, Wolfgang
A1  - Muendlein, Martin
T1  - Ultrashort-pulsed laser separation of glass-silicone-glass substrates: influence of material properties and laser parameters on dicing process and cutting edge geometry
JF  - Applied Physics A
N2  - In recent years, ultrashort pulsed lasers have increased their applicability for industrial requirements, as reliable femtosecond and picosecond laser sources with high output power are available on the market. Compared to conventional laser sources, high quality processing of a large number of material classes with different mechanical and optical properties is possible. In the field of laser cutting, these properties enable the cutting of multilayer substrates with changing material properties. In this work, the femtosecond laser cutting of phosphor sheets is demonstrated. The substrate contains a 230 micrometer thick silicone layer filled with phosphor, which is embedded between two glass plates. Due to the softness and thermal sensitivity of the silicone layer in combination with the hard and brittle dielectric material, the separation of such a material combination is challenging for both mechanical separation processes and cutting with conventional laser sources. In our work, we show that the femtosecond laser is suitable to cut the substrate with a high cutting edge quality. In addition to the experimental results of the laser dicing process, we present a universal model that allows predicting the final cutting edge geometry of a multilayer substrate.
KW  - Femtosecond laser
KW  - Laser ablation
KW  - Laser dicing
KW  - Phosphor sheets
KW  - LED
Y1  - 2021
SN  - 1432-0630
SS  - 1432-0630
SN  - 0947-8396
SS  - 0947-8396
U6  - https://doi.org/10.1007/s00339-020-04192-z
DO  - https://doi.org/10.1007/s00339-020-04192-z
VL  - 127. Jg.
IS  - H. 1
SP  - 7
S1  - 7
ER  -