@article{LandsiedelTschannettLenningeretal.2023,
  author    = {Justus Landsiedel and Jacqueline Tschannett and Margit Lenninger and Sandra Stroj and Matthias Domke and Thomas Bechtold and Tung Pham and Noem{\´i} Aguil{\´o}-Aguayo},
  title     = {A siloxane interlayer approach to enhance surface metallization on polyamide fabrics via electroless copper deposition},
  series   = {Surfaces and Interfaces},
  volume    = {42},
  number    = {Part B},
  issn      = {2468-0230},
  doi       = {10.1016/j.surfin.2023.103434},
  year      = {2023},
  abstract  = {Synthetic polymers, such as polyamide (PA), inherently possess a moderate number of surface functionalities compared to natural polymers, which negatively impacts the uniformity of metallic coatings obtained through wet-chemical methods like electroless plating. The paper presents the use of a siloxane interlayer formed from the condensation of the hydrolyzed 3-triethoxysilylpropyl succinic anhydride (TESPSA) precursor as a strategy to modify the surface properties of polyamide 6.6 (PA66) fabrics and improve the uniformity of the copper surface coating. The application of the siloxane intermediate coating demonstrates a significant improvement in electrical conductivity, up to 20 times higher than fabrics without the interlayer. The morphology of the coatings was investigated using scanning electron (SEM) and laser confocal scanning microscopy (LSM). In addition, dye adsorption, flexural rigidity, air permeability and contact angle measurements were conducted to monitor the change in the PA66 properties after the siloxane functionalization.},
  language  = {en}
}