TY  - CHAP
U1  - Konferenzveröffentlichung
A1  - Sagmeister, Martin
A1  - Jessenig, Stefan
A1  - Muellner, Paul
A1  - Nevlacsil, Stefan
A1  - Maese-Novo, Alejandro
A1  - Eggeling, Moritz
A1  - Hainberger, Rainer
A1  - Seyringer, Dana
A1  - Drexler, Wolfgang
A1  - Rank, Elisabet
A1  - Kraft, Jochen
ED  - Kayahan, Ersin
ED  - Oral, Ahmet Yavuz
ED  - Aköz, Mehmet Emre
ED  - Aksan, Onur Alp
ED  - Cinar, Ibrahim
T1  - Development of a monolithically integrated, CMOS-compatible SiN photonics process flow for sensor and medical applications
T2  - Interphotonics 2019. Book of abstracts. 2nd International Conference on Photonics Research. November 4-9 2019. Antalya, Turkey
N2  - Abstract: ams AG is a leading provider of sensing solutions developing semiconductor sensors in a wide variety of fields, with optical sensing as one of the key competences. Since integrated photonics is a promising technology for new sensor systems, ams AG has been developing processes for fully integrated CMOS-compatible photonic components based on Si3N4. This talk will provide an overview on the processing of basic photonic building blocks and their optical properties and performance. We will also give examples for applications in the fields of optical coherence tomography and opto-chemical gas sensing. In the 1980s photonics started its way for common use in telecommunication technology, using optical fiber technologies. In recent years, also a variety of photonic sensors has been proposed and developed. One of the major drawbacks of most of these photonic devices has been the lack of integration into existing (semiconductor) production processes, so far. This integration is feasible using SiN material systems to process monolithically integrated CMOS-compatible photonic sensors in the visible and near-infrared spectrum. We will present the basic processing steps for the SiN photonic technology, the development of some critical processing steps such as SiN deposition and SiN etching as well as several photonic components (waveguides, splitters, etc.) with their optical properties. One of the applications presented relates to optical coherence tomography (OCT), a fast growing imaging technique in ophthalmology. Drawbacks of existing OCT systems are their high costs as well as their bulkiness, which prevents a wider spread use of OCT systems.
One way to overcome both cost and size issues is to integrate optical and electrical components on a single chip. 
Part of this work was carried out in the framework of the projects COHESION (funded by the Austrian Research Promotion Agency (FFG), no. 848588), OCTCHIP (funded by the EU’ Horizon 2020 research and innovation programme, no. 688173), and COLODOR (M-ERA.NET transnational Call 2015, funded by the Austrian Research Promotion Agency (FFG), no.854066, and the Bundesministerium für Bildung und Forschung, Germany).
KW  - SiN Photonics
KW  - Sensor
KW  - CMOS-Compatible
KW  - OCT
KW  - Industry
Y1  - 2019
ER  -