TY - CHAP U1 - Konferenzveröffentlichung A1 - Chovan, Jozef A1 - Tomaska, Martin A1 - Uherek, Frantisek A1 - Hasko, Daniel A1 - Seyringer, Dana A1 - Gajdosova, Lenka A1 - Koza, Eduard A1 - Pavlov, Jozef T1 - Concept of PIC packaging with microwave, DC and fiber array ports T2 - 2019 International Workshop on Fiber Optics in Access Networks (FOAN) N2 - Progress in integrated photonics enables development of integrated photonics circuits with new unique properties, circuits of the future, and overcomes current limits in information and communication technologies. The packaging of photonic integrated circuits is necessary for taking them out of research laboratories into real implementation in the information and communication technology applications. Telecom optical fibers are still being the best transmission medium of digital data and analogue signals for long distance applications. The effective coupling of optical radiation between telecom optical fiber with ten microns core dimension and photonic integrated circuits optical waveguides with submicron dimensions are necessary. To address these challenges, we present our concept of photonics integrated circuit packaging with radio frequency, direct current and fiber array ports with automated active alignment system. KW - integrated photonics KW - photonics integrated circuits KW - packaging KW - information and communication technology KW - concept Y1 - 2019 SN - 978-1-7281-1563-4 SB - 978-1-7281-1563-4 SP - 38 EP - 41 PB - IEEE ER -