@inproceedings{ChovanUherekTomaskaetal.2021,
  author    = {Jozef Chovan and Frantisek Uherek and Martin Tomaska and Lubos Podlucky and Eduard Koza and Jozef Pavlov and Stanislava Serecunova and Dana Seyringer},
  title     = {Temperature characterization of fiber array to photonics chip coupling},
  series = {Proceedings of ADEPT 2021. 9th International Conference on Advances in Electronic and Photonic Technologies. Podbanske, High Tatras, Slovakia. September 20-23, 2021},
  editor    = {Dano Jandura and Petra Maniakova and Ivana Lettrichova and Jaroslav Kovac, Jr.},
  publisher = {University of Zilina in EDIS-Publishing Centre of UZ},
  address   = {Zilina},
  isbn      = {978-80-554-1806-3},
  pages     = {21 -- 24},
  year      = {2021},
  abstract  = {In this paper we report on the experimental test set-up for the temperature characterization of fiber array to photonics chip butt coupling at 1310 nm and 1550 nm wavelengths. The alignment and gluing of fiber arrays to photonics chip were done by automated active alignments system and they were fixed themselves by UV curable epoxy adhesive. Temperature changes of coupling insertion losses are measured and investigated for two different UV adhesives during three temperature cycles from -40 °C to 80 °C in climatic chamber. Spectral dependence of insertion losses was measured and compared before and after three temperature cycles for 1530 nm to 1570 nm spectral range at room temperature.},
  language  = {en}
}