@article{ChovanTomaskaUhereketal.2020,
  author    = {Chovan, Jozef and Tomaska, Martin and Uherek, Frantisek and Hasko, Daniel and Seyringer, Dana and Gajdosova, Lenka and Koza, Eduard and Pavlov, Jozef},
  title     = {Demonstration of automated adjustment and coupling of fiber array to PICs based on the detection of edges},
  series = {Fiber and Integrated Optics},
  volume    = {39. Jg.},
  journal   = {Fiber and Integrated Optics},
  number    = {H. 1},
  doi       = {10.1080/01468030.2020.1717018},
  pages     = {24 -- 38},
  year      = {2020},
  language  = {en}
}
@inproceedings{ChovanTomaskaUhereketal.2019,
  author    = {Chovan, Jozef and Tomaska, Martin and Uherek, Frantisek and Hasko, Daniel and Seyringer, Dana and Gajdosova, Lenka and Koza, Eduard and Pavlov, Jozef},
  title     = {Concept of PIC packaging with microwave, DC and fiber array ports},
  series = {2019 International Workshop on Fiber Optics in Access Networks (FOAN)},
  booktitle = {2019 International Workshop on Fiber Optics in Access Networks (FOAN)},
  publisher = {IEEE},
  isbn      = {978-1-7281-1563-4},
  pages     = {38 -- 41},
  year      = {2019},
  abstract  = {Progress in integrated photonics enables development of integrated photonics circuits with new unique properties, circuits of the future, and overcomes current limits in information and communication technologies. The packaging of photonic integrated circuits is necessary for taking them out of research laboratories into real implementation in the information and communication technology applications. Telecom optical fibers are still being the best transmission medium of digital data and analogue signals for long distance applications. The effective coupling of optical radiation between telecom optical fiber with ten microns core dimension and photonic integrated circuits optical waveguides with submicron dimensions are necessary. To address these challenges, we present our concept of photonics integrated circuit packaging with radio frequency, direct current and fiber array ports with automated active alignment system.},
  language  = {en}
}
@inproceedings{ChovanUherekKozaetal.2019,
  author    = {Chovan, Jozef and Uherek, Frantisek and Koza, Eduard and Pavlov, Jozef and Seyringer, Dana and Gajdosova, Lenka},
  title     = {Design and simulation of fiber to chip butt coupler for SiN integrated photonics},
  series = {ICTON 2019. 21st International Conference on Transparent Optical Networks. 9-13 July 2019, Angers, France},
  booktitle = {ICTON 2019. 21st International Conference on Transparent Optical Networks. 9-13 July 2019, Angers, France},
  editor    = {Jaworski, Marek and Marciniak, Marian},
  publisher = {National Institute of Telecommunications},
  address   = {Warsaw, Poland},
  isbn      = {978-1-7281-2779-8},
  doi       = {10.1109/ICTON.2019.8840203},
  pages     = {4},
  year      = {2019},
  abstract  = {SiN is a suitable material for fabricating of photonic integrated circuits with middle refractive index contrast for the visible and near infrared spectral region with ultra-low propagation losses. The paper deals with the design and simulation of fiber to SiN chip butt coupler with single step fabrication process without thickness tapering. Coupler is designed for 850 nm band for coupling between strip 0.25 μm × 1.00 μm waveguide and Nufern's 780-OCT single mode optical fiber with core diameter 4.4 μm. The coupling losses simulation results of the two simulation methods finite-difference beam propagation techniques and eigenmode expansion method are compared.},
  language  = {en}
}