Temperature stability investigation of fiber array to photonics chip butt coupling
- The main aims of this work are the validation of the developed process of gluing a single-mode optical fiber array with a photonic chip and the selection of a more suitable adhesive from the two adhesives being compared. An active alignment system was used for adjusting the two optical fiber arrays to a photonics chip. The gluing was done by two compared UV curable adhesives applied in the optical path. The insertion losses of glued coupling were measured and investigated at two discrete wavelengths 1310 nm and 1550 nm during temperature testing in the climatic chamber according to Telcordia GR_1209_Corei04 [3]. The measurement, investigation, and comparison of insertion losses of the glued coupling at the spectral band from 1530 nm to 1570 nm were done immediately after gluing process and after three temperature cycles in the climatic chamber with one month delay.
| Author: | Jozef Chovan, Frantisek Uherek, Martin Tomaska, Eduard Koza, Jozef Pavlov, Stanislava Serecunova, Dana SeyringerORCiD |
|---|---|
| DOI: | https://doi.org/10.1063/5.0143468 |
| ISSN: | 0094-243X |
| Parent Title (English): | Proceedings of the 11th International Advances in Applied Physics and Materials Science Congress & Exhibition. 17–21 October, 2021. Fethiye, Turkey. |
| Publisher: | AIP Publishing |
| Place of publication: | Melville, NY |
| Document Type: | Conference Proceeding |
| Language: | English |
| Year of publication: | 2023 |
| Release Date: | 2024/01/17 |
| Tag: | Temperature stability; fiber array; photonics; photonics chip butt coupling |
| Issue: | 2803,1 |
| Number of pages: | 4 |
| First Page: | 1 |
| Last Page: | 4 |
| Organisationseinheit: | Forschung / Forschungszentrum Mikrotechnik |
| DDC classes: | 500 Naturwissenschaften und Mathematik |
| JEL-Classification: | Z Other Special Topics |
| Open Access?: | nein |
| Peer review: | wiss. Beitrag, nicht peer-reviewed |
| Publicationlist: | Seyringer, Dana |
