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Temperature stability of fiber array to photonics chip butt coupling

  • A Telecom optical fibers are still being the best transmission medium of digital data and analogue signals for long distance applications. Progress in integrated photonics enables development of photonic chips with new unique properties, circuits of the future, and overcomes current limits in information and communication technologies. The packaging of photonic chips is necessary for taking them out of research laboratories into real implementation in the information and communication technology applications. One important step of packaging is effective coupling of optical radiation between telecom optical fiber with ten microns core dimension and photonic chip optical waveguide with submicron dimensions. For complex photonic chips, it is necessary to couple not one optical fiber but several optical fibers, which are arranged in fiber arrays. In this case, it is necessary to use a 6D positioning system, which allows to optimally adjust the relative position of the photonic chip and the fiber arrays. After setting the optimal relative position of the photonic chip and the fiber array, the process of their fixation follows. One possibility of fixation is gluing with an adhesive in the optical path between the photonic chip and an array of optical fibers with a refractive index close to the refractive index of the optical fiber core. This paper is focused on the experimental test set-up for the temperature characterization of fiber array to photonics chip butt coupling at 1310 nm and 1550 nm wavelengths fixed themselves by UV adhesive in the optical path. The main aims of this works are selection of better adhesive from two types for gluing of photonic chip and fiber array in packaging process of photonics chips and validation of gluing process developing. The coupling and alignment of fiber arrays to photonics chip were done by automated active alignments system and they were fixed themselves by curable epoxy adhesive. Temperature changes of coupling insertion losses are measured and investigated for two different UV adhesives during three temperature cycles from -40 °C to 80 °C in climatic chamber according to Telcordia. Spectral dependence of insertion losses were measured and compared before and after three temperature cycles for 1530 nm to 1570 nm spectral range at room temperature. This work was supported by the Slovak Research and Development Agency under the contracts APVV-17-0662 and SK-AT-20-0017 and by the COST Action “European Network for High Performance Integrated Microwave Photonics” (EUIMWP) CA16220.

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Metadaten
Author:Jozef Chovan, Frantisek Uherek, Martin Tomaska, Eduard Koza, Jozef Pavlov, Stanislava SerecunovaORCiD, Dana SeyringerORCiD
URL:https://dergipark.org.tr/en/pub/actamat/issue/65726/1020525
Date:13.12.2021
ISSN:2630-5909
Parent Title (English):Acta Materialia Turcica
Document Type:Article
Language:English
Year of publication:2021
Release Date:2021/12/13
Tag:Active alignment; Characterization; Fiber arrays; Photonics integrated circuit; Temperature
Volume:o.Jg.
Issue:Special Issue: Interphotonics 2021. 3rd International Conference on Photonics Research. Book of Abstracts
First Page:16
Last Page:17
Organisationseinheit:Forschung / Forschungszentrum Mikrotechnik
DDC classes:500 Naturwissenschaften und Mathematik
Open Access?:nein
Peer review:wiss. Beitrag, nicht peer-reviewed
Publicationlist:Seyringer, Dana