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Micromachining of silicon carbide using femtosecond lasers

  • We have demonstrated micromachining of bulk 3C silicon carbide (3C- SiC) wafers by employing 1028nm wavelength femtosecond laser pulses of energy less than 10 nJ directly from a femtosecond laser oscillator, thus eliminating the need for an amplified system and increasing the micromachining speed by more than four orders of magnitude.

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Metadaten
Author:Maria Farsari, George Filippidis, Sandra Zoppel, Georg A. Reider, Costas Fotakis
DOI:https://doi.org/10.1088/1742-6596/59/1/018
Parent Title (English):Journal of Physics: Conference Series
Document Type:Article
Language:English
Year of publication:2007
Release Date:2020/12/22
Volume:59. Jg.
Issue:Eighth International Conference on Laser Ablation. Banff, Canada. 11–16 September, 2005/018
First Page:84
Last Page:87
Organisationseinheit:Forschung / Forschungszentrum Mikrotechnik
DDC classes:500 Naturwissenschaften und Mathematik / 530 Physik
Open Access?:ja
Peer review:wiss. Beitrag, peer-reviewed
Publicationlist:Stroj, Sandra
Licence (German):License LogoCreative Commons - CC BY - NC - SA - 4.0 International - Attribution - NonCommercial –ShareAlike - Namensnennung - Nicht kommerziell - Weitergabe unter gleichen Bedingungen