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Temperature characterization of fiber array to photonics chip coupling

  • In this paper we report on the experimental test set-up for the temperature characterization of fiber array to photonics chip butt coupling at 1310 nm and 1550 nm wavelengths. The alignment and gluing of fiber arrays to photonics chip were done by automated active alignments system and they were fixed themselves by UV curable epoxy adhesive. Temperature changes of coupling insertion losses are measured and investigated for two different UV adhesives during three temperature cycles from -40 °C to 80 °C in climatic chamber. Spectral dependence of insertion losses was measured and compared before and after three temperature cycles for 1530 nm to 1570 nm spectral range at room temperature.

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Metadaten
Author:Jozef Chovan, Frantisek Uherek, Martin Tomaska, Lubos Podlucky, Eduard Koza, Jozef Pavlov, Stanislava SerecunovaORCiD, Dana SeyringerORCiD
ISBN:978-80-554-1806-3
Parent Title (English):Proceedings of ADEPT 2021. 9th International Conference on Advances in Electronic and Photonic Technologies. Podbanske, High Tatras, Slovakia. September 20-23, 2021
Publisher:University of Zilina in EDIS-Publishing Centre of UZ
Place of publication:Zilina
Editor:Dano Jandura, Petra Maniakova, Ivana Lettrichova, Jaroslav Kovac, Jr.
Document Type:Conference Proceeding
Language:English
Year of publication:2021
Release Date:2021/12/09
Tag:Fibre array; Temperature characterization
First Page:21
Last Page:24
Organisationseinheit:Forschung / Forschungszentrum Mikrotechnik
DDC classes:500 Naturwissenschaften und Mathematik
Open Access?:nein
Peer review:wiss. Beitrag, nicht peer-reviewed
Publicationlist:Seyringer, Dana