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Ultrafast-laser dicing of thin silicon wafers: strategies to improve front- and backside breaking strength

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Metadaten
Author:Matthias Domke, Bernadette Egle, Sandra Stroj, Marius Bodea, Elisabeth Schwarz, Gernot Fasching
DOI:https://doi.org/10.1007/s00339-017-1374-7
Parent Title (English):Applied Physics A
Document Type:Article
Language:English
Year of publication:2017
Release Date:2020/03/06
Volume:123
Issue:12/746
Number og pages:8
Organisationseinheit:Forschung / Forschungszentrum Mikrotechnik
DDC classes:600 Technik, Medizin, angewandte Wissenschaften
Open Access?:ja
Peer review:wiss. Beitrag, peer-reviewed
Publicationlist:Domke, Matthias
Stroj, Sandra
Licence (German):License LogoCreative Commons - CC BY - International - Attribution- Namensnennung 4.0