Open Access

A Telecom optical fibers are still being the best transmission medium of digital data and analogue signals for long distance applications. Progress in integrated photonics enables development of photonic chips with new unique properties, circuits of the future, and overcomes current limits in information and communication technologies. The packaging of photonic chips is necessary for taking them out of research laboratories into real implementation in the information and communication technology applications. One important step of packaging is effective coupling of optical radiation between telecom optical fiber with ten microns core dimension and photonic chip optical waveguide with submicron dimensions. For complex photonic chips, it is necessary to couple not one optical fiber but several optical fibers, which are arranged in fiber arrays. In this case, it is necessary to use a 6D positioning system, which allows to optimally adjust the relative position of the photonic chip and the fiber arrays. After setting the optimal relative position of the photonic chip and the fiber array, the process of their fixation follows. One possibility of fixation is gluing with an adhesive in the optical path between the photonic chip and an array of optical fibers with a refractive index close to the refractive index of the optical fiber core. This paper is focused on the experimental test set-up for the temperature characterization of fiber array to photonics chip butt coupling at 1310 nm and 1550 nm wavelengths fixed themselves by UV adhesive in the optical path. The main aims of this works are selection of better adhesive from two types for gluing of photonic chip and fiber array in packaging process of photonics chips and validation of gluing process developing. The coupling and alignment of fiber arrays to photonics chip were done by automated active alignments system and they were fixed themselves by curable epoxy adhesive. Temperature changes of coupling insertion losses are measured and investigated for two different UV adhesives during three temperature cycles from -40 °C to 80 °C in climatic chamber according to Telcordia. Spectral dependence of insertion losses were measured and compared before and after three temperature cycles for 1530 nm to 1570 nm spectral range at room temperature. This work was supported by the Slovak Research and Development Agency under the contracts APVV-17-0662 and SK-AT-20-0017 and by the COST Action “European Network for High Performance Integrated Microwave Photonics” (EUIMWP) CA16220.

We present a new concept of 3D polymer-based 1 × 4 beam splitter for wavelength splitting around 1550 nm. The beam splitter consists of IP-Dip polymer as a core and polydimethylsiloxane (PDMS) Sylgard 184 as a cladding. The splitter was designed and simulated with two different photonics tools and the results show high splitting ratio for single-mode and multi-mode operation with low losses. Based on the simulations, a 3D beam splitter was designed and realized using direct laser writing (DLW) process with adaptation to coupling to standard single-mode fiber. With respect to the technological limits, the multi-mode splitter having core of (4 × 4) μm 2 was designed and fabricated together with supporting stable mechanical construction. Splitting properties were investigated by intensity monitoring of splitter outputs using optical microscopy and near-field scanning optical microscopy. In the development phase, the optical performance of fabricated beam splitter was examined by splitting of short visible wavelengths using red light emitting diode. Finally, the splitting of 1550 nm laser light was studied in detail by near-field measurements and compared with the simulated results. The nearly single-mode operation was observed and the shape of propagating mode and mode field diameter was well recognized.

Steigende Komplexität von Geschäftsmodellen und in der Niedrigzinsphase stets zulegende Renditeerwartungen an kapitalmarktorientierte Unternehmen führen dazu, dass sich deren Berichterstattung anpasst. Unter anderem ist eine verstärkte Verbreitung und Anwendung von Key Performance Indicators (alternative Führungsgrößen) in der Praxis zu beobachten. Wenigen, zwar prägnanten, aber eben nicht einheitlich definierten oder gar nach geltenden Rechnungslegungsnormen objektiv zu gewinnende Messgrößen kommt eine gesteigerte Bedeutung im externen Berichtswesen zu. Der Beitrag liefert eine Bestandesaufnahme der meist verwendeten Key Performance Indicators in der Praxis in Deutschland, in Österreich und in der Schweiz.