Open Access

Recently the use of microRNAs (miRNAs) as biomarkers for a multitude of diseases has gained substantial significance for clinical as well as point-of-care diagnostics. Amongst other challenges, however, it holds the central requirement that the concentration of a given miRNA must be evaluated within the context of other factors in order to unambiguously diagnose one specific disease. In terms of the development of diagnostic methods and devices, this implies an inevitable demand for multiplexing in order to be able to gauge the abundance of several components of interest in a patient’s sample in parallel. In this study, we design and implement different multiplexed versions of our electrochemical microfluidic biosensor by dividing its channel into subsections, creating four novel chip designs for the amplification-free and simultaneous quantification of up to eight miRNAs on the CRISPR-Biosensor X (‘X’ highlighting the multiplexing aspect of the device). We then use a one-step model assay followed by amperometric readout in combination with a 2-minute-stop-flow-protocol to explore the fluidic and mechanical characteristics and limitations of the different versions of the device. The sensor showing the best performance, is subsequently used for the Cas13a-powered proof-of-concept measurement of two miRNAs (miRNA-19b and miRNA-20a) from the miRNA-17∼92 cluster, which is dysregulated in the blood of pediatric medulloblastoma patients. Quantification of the latter, alongside simultaneous negative control measurements are accomplished on the same device. We thereby confirm the applicability of our platform to the challenge of amplification-free, parallel detection of multiple nucleic acids.

The goal of this paper is to design a low-loss 1 x 32 Y-branch optical splitter for optical transmission systems, using two different design tools employing Beam Propagation Method. As a first step, a conventional 1 x 32 Y-branch splitter was designed and simulated in two-dimensional environment of OptiBPM photonic tool. The simulated optical properties feature high loss, high asymmetric splitting ratio and a large size of the designed structure, too. In the second step of this work we propose an optimization of the conventional splitter design leading to suppression of the asymmetric splitting ratio to one-third of its initial value and to the improvement of the losses by nearly 2 dB. In addition, 50% size reduction of the designed structure was also achieved. This length-optimized low-loss splitter was then modelled in a three-dimensional environment of RSoft photonic tool and the simulated results confirm the strong improvement of the optical properties.

A Telecom optical fibers are still being the best transmission medium of digital data and analogue signals for long distance applications. Progress in integrated photonics enables development of photonic chips with new unique properties, circuits of the future, and overcomes current limits in information and communication technologies. The packaging of photonic chips is necessary for taking them out of research laboratories into real implementation in the information and communication technology applications. One important step of packaging is effective coupling of optical radiation between telecom optical fiber with ten microns core dimension and photonic chip optical waveguide with submicron dimensions. For complex photonic chips, it is necessary to couple not one optical fiber but several optical fibers, which are arranged in fiber arrays. In this case, it is necessary to use a 6D positioning system, which allows to optimally adjust the relative position of the photonic chip and the fiber arrays. After setting the optimal relative position of the photonic chip and the fiber array, the process of their fixation follows. One possibility of fixation is gluing with an adhesive in the optical path between the photonic chip and an array of optical fibers with a refractive index close to the refractive index of the optical fiber core. This paper is focused on the experimental test set-up for the temperature characterization of fiber array to photonics chip butt coupling at 1310 nm and 1550 nm wavelengths fixed themselves by UV adhesive in the optical path. The main aims of this works are selection of better adhesive from two types for gluing of photonic chip and fiber array in packaging process of photonics chips and validation of gluing process developing. The coupling and alignment of fiber arrays to photonics chip were done by automated active alignments system and they were fixed themselves by curable epoxy adhesive. Temperature changes of coupling insertion losses are measured and investigated for two different UV adhesives during three temperature cycles from -40 °C to 80 °C in climatic chamber according to Telcordia. Spectral dependence of insertion losses were measured and compared before and after three temperature cycles for 1530 nm to 1570 nm spectral range at room temperature. This work was supported by the Slovak Research and Development Agency under the contracts APVV-17-0662 and SK-AT-20-0017 and by the COST Action “European Network for High Performance Integrated Microwave Photonics” (EUIMWP) CA16220.

We have demonstrated micromachining of bulk 3C silicon carbide (3C- SiC) wafers by employing 1028nm wavelength femtosecond laser pulses of energy less than 10 nJ directly from a femtosecond laser oscillator, thus eliminating the need for an amplified system and increasing the micromachining speed by more than four orders of magnitude.

In this paper, we propose and simulate a new type of three-dimensional (3D) optical splitter based on multimode interference (MMI) for the wavelength of 1550 nm. The splitter was proposed on the square basis with the width of 20 x 20 µm2 using the IP-Dip polymer as a standard material for 3D laser lithography. We present the optical field distribution in the proposed MMI splitter and its integration possibility on optical fiber. The design is aimed to the possible fabrication process using the 3D laser lithography for forthcoming experiments.

In this work, we present a significant step toward in vivo ophthalmic optical coherence tomography and angiography on a photonic integrated chip. The diffraction gratings used in spectral-domain optical coherence tomography can be replaced by photonic integrated circuits comprising an arrayed waveguide grating. Two arrayed waveguide grating designs with 256 channels were tested, which enabled the first chip-based optical coherence tomography and angiography in vivo three-dimensional human retinal measurements. Design 1 supports a bandwidth of 22 nm, with which a sensitivity of up to 91 dB (830 µW) and an axial resolution of 10.7 µm was measured. Design 2 supports a bandwidth of 48 nm, with which a sensitivity of 90 dB (480 µW) and an axial resolution of 6.5 µm was measured. The silicon nitride-based integrated optical waveguides were fabricated with a fully CMOS-compatible process, which allows their monolithic co-integration on top of an optoelectronic silicon chip. As a benchmark for chip-based optical coherence tomography, tomograms generated by a commercially available clinical spectral-domain optical coherence tomography system were compared to those acquired with on-chip gratings. The similarities in the tomograms demonstrate the significant clinical potential for further integration of optical coherence tomography on a chip system.

In this study, we carried out the structural and thermal characterization of a medical-grade poly (lactide) (PLA) by SEC, TGA, DSC, NMR, ICP-MS and Py-GC/MS. Moreover, we investigated the laser-induced degradation occurring when ultrashort laser pulses (ULP) were employed to cut extremely thin polymer films prepared by solvent-casting. ULP polymer cutting technology is an interesting manufacturing process for its advantages in potential medical applications. In fact, heat transmission to the region surrounding the cuts is limited, so that the incisions are precise and the effects on the regions around them are small. In this way, the need for post-processing is reduced and ULP cutting becomes interesting for industrial applications. However, degradation induced by ULP may occur and compromise the properties of the polymer samples. To investigate this possibility, portions of PLA films, ultrashort laser cut (ULC) and uncut, were analysed by SEC, DSC, NMR and FTIR. Furthermore, PLA oligomers were studied by ESI-MS. Both SEC and NMR showed a decrease in the molecular weight. FTIR, ESI-MS and NMR spectra revealed the presence of olefin end groups originated from a \beta-H transfer mechanism, induced by heat and/or light (Norrish II mechanism). Additionally, the inspection of the ESI mass spectra highlighted the cleavage of ester bonds related to the Norrish I type mechanism, undetected by the other techniques.