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In this paper, low-loss Y-branch splitters up to 128 splitting ratio are designed, simulated, and optimized by using 2D beam propagation method in OptiBPM tool by Optiwave. For an optical waveguide, a silica-on-silicon material platform is used. The splitters were designed as a planar structure for a telecommunication operating wavelength of 1.55 m. According to the minimum insertion loss and minimum non-uniformity, the optimum length for each Y-branch is determined. The influence of the pre-defined S-Bend waveguide shapes (Arc, Cosine, Sine) and of the waveguide core size reduction on the splitter performance has been also studied. The obtained simulation results of all designed splitters with different S-Bend shape waveguides together with the different waveguide core sizes are discussed and compared with each other.
A Telecom optical fibers are still being the best transmission medium of digital data and analogue signals for long distance applications. Progress in integrated photonics enables development of photonic chips with new unique properties, circuits of the future, and overcomes current limits in information and communication technologies. The packaging of photonic chips is necessary for taking them out of research laboratories into real implementation in the information and communication technology applications. One important step of packaging is effective coupling of optical radiation between telecom optical fiber with ten microns core dimension and photonic chip optical waveguide with submicron dimensions. For complex photonic chips, it is necessary to couple not one optical fiber but several optical fibers, which are arranged in fiber arrays. In this case, it is necessary to use a 6D positioning system, which allows to optimally adjust the relative position of the photonic chip and the fiber arrays. After setting the optimal relative position of the photonic chip and the fiber array, the process of their fixation follows. One possibility of fixation is gluing with an adhesive in the optical path between the photonic chip and an array of optical fibers with a refractive index close to the refractive index of the optical fiber core. This paper is focused on the experimental test set-up for the temperature characterization of fiber array to photonics chip butt coupling at 1310 nm and 1550 nm wavelengths fixed themselves by UV adhesive in the optical path. The main aims of this works are selection of better adhesive from two types for gluing of photonic chip and fiber array in packaging process of photonics chips and validation of gluing process developing. The coupling and alignment of fiber arrays to photonics chip were done by automated active alignments system and they were fixed themselves by curable epoxy adhesive. Temperature changes of coupling insertion losses are measured and investigated for two different UV adhesives during three temperature cycles from -40 °C to 80 °C in climatic chamber according to Telcordia. Spectral dependence of insertion losses were measured and compared before and after three temperature cycles for 1530 nm to 1570 nm spectral range at room temperature.
This work was supported by the Slovak Research and Development Agency under the contracts APVV-17-0662 and SK-AT-20-0017 and by the COST Action “European Network for High Performance Integrated Microwave Photonics” (EUIMWP) CA16220.
The main aims of this work are the validation of the developed process of gluing a single-mode optical fiber array with a photonic chip and the selection of a more suitable adhesive from the two adhesives being compared. An active alignment system was used for adjusting the two optical fiber arrays to a photonics chip. The gluing was done by two compared UV curable adhesives applied in the optical path. The insertion losses of glued coupling were measured and investigated at two discrete wavelengths 1310 nm and 1550 nm during temperature testing in the climatic chamber according to Telcordia GR_1209_Corei04 [3]. The measurement, investigation, and comparison of insertion losses of the glued coupling at the spectral band from 1530 nm to 1570 nm were done immediately after gluing process and after three temperature cycles in the climatic chamber with one month delay.
In this paper we report on the experimental test set-up for the temperature characterization of fiber array to photonics chip butt coupling at 1310 nm and 1550 nm wavelengths. The alignment and gluing of fiber arrays to photonics chip were done by automated active alignments system and they were fixed themselves by UV curable epoxy adhesive. Temperature changes of coupling insertion losses are measured and investigated for two different UV adhesives during three temperature cycles from -40 °C to 80 °C in climatic chamber. Spectral dependence of insertion losses was measured and compared before and after three temperature cycles for 1530 nm to 1570 nm spectral range at room temperature.
This study presents different approaches to increase the sensing area of NiO based semiconducting metal oxide gas sensors. Micro- and nanopatterned laser induced periodic surface structures (LIPSS) are generated on silicon and Si/SiO2 substrates. The surface morphologies of the fabricated samples are examined by FE SEM. We select the silicon samples with an intermediate Si3N4 layer due to its superior isolation quality over the thermal oxide for evaluating the hydrogen and acetone sensitivity of a NiO based test sensor.
This paper presents design, simulation, and optimization of the three-dimensional 1×4 optical multimode interference splitter using IP-Dip polymer as a core and polydimethylsiloxane (PDMS) Sylgard 184 as a cladding. The splitter was simulated by using beam propagation method in BeamPROP simulation engine of RSoft photonic tool and optimized for an operating wavelength of 1.55 µm. According to the minimum insertion loss, the dimensions of the MMI coupler and the length of the whole MMI splitter structure were optimized applying a waveguide with a core size of 4×4 µm2. The objective of the study is to create a design for fabrication by three-dimensional direct laser writing optical lithography.
The paper deals with the optimization of 2x2 optical switch for photonic integrated circuits based on two 2x2 MMI splitters and two phase-modulators. The optical switch was modelled in the RSoftCAD with the simulation tool BeamPROP. The optimization was done to minimise the insertion losses and broaden the spectral band at 1550 nm by using linear tapers in a 2x2 MMI splitter topology. The 2x2 optical switch is a common element for creating more complex 1xN or NxN optical switches in all-optical signal processing.
In this work, we investigated the influence of different etch depths of the rib waveguides on the performance of SiN-based AWGs. For this purpose, an 8-channel 100 GHz AWG was designed for a center wavelength of 850 nm. The design parameters entered were calculated using the AWG-Parameters tool. The simulations were performed with a commercial photonic tool PHASAR from Optiwave. The simulated performance was evaluated using the AWG-Analyzer tool. For the AWG design, we used three identical rib waveguides with different etch depths to simulate possible etch imperfection. The simulations show the wavelength shift and degradation of the AWG performance.
This paper presents the design, simulation, and optimization of a 1×128 multimode interference (MMI) splitter with a silica-on-silicon channel profile. This work aims to study the influence of the different S-Bend output waveguide shapes at the end of the MMI coupler on the final optical properties. The 1×128 MMI splitters have been simulated using beam propagation method in OptiBPM software. The optical properties of all considered splitters with different shapes of outputs waveguides are discussed and compared with each other. Based on the minimum insertion loss and non-uniformity, the final shape of output waveguides, ensuring the lowest losses, is determined.