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A Telecom optical fibers are still being the best transmission medium of digital data and analogue signals for long distance applications. Progress in integrated photonics enables development of photonic chips with new unique properties, circuits of the future, and overcomes current limits in information and communication technologies. The packaging of photonic chips is necessary for taking them out of research laboratories into real implementation in the information and communication technology applications. One important step of packaging is effective coupling of optical radiation between telecom optical fiber with ten microns core dimension and photonic chip optical waveguide with submicron dimensions. For complex photonic chips, it is necessary to couple not one optical fiber but several optical fibers, which are arranged in fiber arrays. In this case, it is necessary to use a 6D positioning system, which allows to optimally adjust the relative position of the photonic chip and the fiber arrays. After setting the optimal relative position of the photonic chip and the fiber array, the process of their fixation follows. One possibility of fixation is gluing with an adhesive in the optical path between the photonic chip and an array of optical fibers with a refractive index close to the refractive index of the optical fiber core. This paper is focused on the experimental test set-up for the temperature characterization of fiber array to photonics chip butt coupling at 1310 nm and 1550 nm wavelengths fixed themselves by UV adhesive in the optical path. The main aims of this works are selection of better adhesive from two types for gluing of photonic chip and fiber array in packaging process of photonics chips and validation of gluing process developing. The coupling and alignment of fiber arrays to photonics chip were done by automated active alignments system and they were fixed themselves by curable epoxy adhesive. Temperature changes of coupling insertion losses are measured and investigated for two different UV adhesives during three temperature cycles from -40 °C to 80 °C in climatic chamber according to Telcordia. Spectral dependence of insertion losses were measured and compared before and after three temperature cycles for 1530 nm to 1570 nm spectral range at room temperature.
This work was supported by the Slovak Research and Development Agency under the contracts APVV-17-0662 and SK-AT-20-0017 and by the COST Action “European Network for High Performance Integrated Microwave Photonics” (EUIMWP) CA16220.
The main aims of this work are the validation of the developed process of gluing a single-mode optical fiber array with a photonic chip and the selection of a more suitable adhesive from the two adhesives being compared. An active alignment system was used for adjusting the two optical fiber arrays to a photonics chip. The gluing was done by two compared UV curable adhesives applied in the optical path. The insertion losses of glued coupling were measured and investigated at two discrete wavelengths 1310 nm and 1550 nm during temperature testing in the climatic chamber according to Telcordia GR_1209_Corei04 [3]. The measurement, investigation, and comparison of insertion losses of the glued coupling at the spectral band from 1530 nm to 1570 nm were done immediately after gluing process and after three temperature cycles in the climatic chamber with one month delay.
In this paper we report on the experimental test set-up for the temperature characterization of fiber array to photonics chip butt coupling at 1310 nm and 1550 nm wavelengths. The alignment and gluing of fiber arrays to photonics chip were done by automated active alignments system and they were fixed themselves by UV curable epoxy adhesive. Temperature changes of coupling insertion losses are measured and investigated for two different UV adhesives during three temperature cycles from -40 °C to 80 °C in climatic chamber. Spectral dependence of insertion losses was measured and compared before and after three temperature cycles for 1530 nm to 1570 nm spectral range at room temperature.
The paper deals with designing and numerical modelling a 2 x 2 optical switch for photonic integrated circuits based on 2 x 2 MMI elements and phase modulators. The 2 x 2 optical switch was modelled in the RsoftCAD with the simulation tool BeamPROP. The 2 x 2 optical switch is a common element for creating more complex 1 x N or N x N optical switches in all-optical signal processing.
The paper deals with the optimization of 2x2 optical switch for photonic integrated circuits based on two 2x2 MMI splitters and two phase-modulators. The optical switch was modelled in the RSoftCAD with the simulation tool BeamPROP. The optimization was done to minimise the insertion losses and broaden the spectral band at 1550 nm by using linear tapers in a 2x2 MMI splitter topology. The 2x2 optical switch is a common element for creating more complex 1xN or NxN optical switches in all-optical signal processing.
This study presents different approaches to increase the sensing area of NiO based semiconducting metal oxide gas sensors. Micro- and nanopatterned laser induced periodic surface structures (LIPSS) are generated on silicon and Si/SiO2 substrates. The surface morphologies of the fabricated samples are examined by FE SEM. We select the silicon samples with an intermediate Si3N4 layer due to its superior isolation quality over the thermal oxide for evaluating the hydrogen and acetone sensitivity of a NiO based test sensor.
A new software tool, called AWG-Channel-Spacing, is developed to calculate accurate channel spacing of an arrayed waveguide gratings (AWG) optical multiplexer/demultiplexer. This tool has been developed with the application framework QT in the programming language C++. The tool was evaluated with a design of 20-channel 200 GHz AWG. The achieved simulated transmission characteristics prove the correct functionality of the tool.
A new software tool, called AWG-Wuckler, is developed to calculate geometric parameters of arrayed waveguide grating structures for telecommunication and medical applications. These parameters are crucial for a AWG layout which will be created and simulated using commercial photonic design tools. The design process of AWG is very complex because its geometric dimensions depend on a large number of input design parameters and other input design parameters. Often geometric constraints require an adjustment of the input design parameters and vice versa. Calculation and adjustment of the geometric parameters is a time-consuming process that is currently not fully supported by any commercial photonic tool. AWG-Wuckler tool overcomes this issue and offers a fast and easy to use solution. The tool was already applied in various AWG designs and is technologically well proven.
In this paper, we propose and simulate a new type of three-dimensional (3D) optical splitter based on multimode interference (MMI) for the wavelength of 1550 nm. The splitter was proposed on the square basis with the width of 20 x 20 µm2 using the IP-Dip polymer as a standard material for 3D laser lithography. We present the optical field distribution in the proposed MMI splitter and its integration possibility on optical fiber. The design is aimed to the possible fabrication process using the 3D laser lithography for forthcoming experiments.
In this paper, we document optical splitters based on Y-branch and also on MMI splitting principle. The 1×4 Y-branch splitter was prepared in 3D geometry fully from polymer approaching the single mode transmission at 1550 nm. We also prepared new concept of 1×4 MMI optical splitter. Their optical properties and character of output optical field were measured by near-field scanning optical microscope. Splitting properties and optical outputs of both splitters are very promising and increase an attractiveness of presented 3D technology and polymers.