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Modern portable electronic devices have seen component heat load increasing, while the space available for heat dissipation has decreased. This requires the thermal management system to be optimized to attain the high performance heat sink. Heat sinks plays a major role for dissipating heat in electronic devices. Phase change material (PCM) is used to enhance the heat dissipation in heat sink. This paper reports the results of an experimental investigation of the performance of Pin fin heat sinks filled with phase change materials for thermal management of electronic devices. The experimental set ups are prepared with the graphical programming language with Lab VIEW (Laboratory Virtual Instruments for Engineering Workbench. Three different types of Pin fin Heat sink with and without PCM are investigated based on different operational timings and the temperature is acquired with the help of Data Acquisition Card (DAQ). The results indicated that the inclusion of the PCM could stabilize the temperature for a longer period and reduce the heating rates and peak temperatures of heat sink with increasing the number of fins can enhance the thermal performance of electronic devices.