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Learning together
(2019)
Progress in integrated photonics enables development of integrated photonics circuits with new unique properties, circuits of the future, and overcomes current limits in information and communication technologies. The packaging of photonic integrated circuits is necessary for taking them out of research laboratories into real implementation in the information and communication technology applications.
Telecom optical fibers are still being the best transmission medium of digital data and analogue signals for long distance applications. The effective coupling of optical radiation between telecom optical fiber with ten microns core dimension and photonic integrated circuits optical waveguides with submicron dimensions are necessary. To address these challenges, we present our concept of photonics integrated circuit packaging with radio frequency, direct current and fiber array ports with automated active alignment system.
SiN is a suitable material for fabricating of photonic integrated circuits with middle refractive index contrast for the visible and near infrared spectral region with ultra-low propagation losses. The paper deals with the design and simulation of fiber to SiN chip butt coupler with single step fabrication process without thickness tapering. Coupler is designed for 850 nm band for coupling between strip 0.25 μm × 1.00 μm waveguide and Nufern's 780-OCT single mode optical fiber with core diameter 4.4 μm. The coupling losses simulation results of the two simulation methods finite-difference beam propagation techniques and eigenmode expansion method are compared.
On the extension of digital ecosystems for SCM and customs with distributed ledger technologies
(2019)
Global supply chains represent the backbone of the modern manufacturing industry. Planning of global supply chains still represents a major hurdle, mainly because of the high complexity and unforeseen disruptions that have to be mastered for meeting the different logistics windows in a globally distributed production environment. Trust in supply chains is an additional challenge. A major – albeit sometimes overlooked - part of Supply Chain Management (SCM) is the management and integration of customs processes, clearing of tariffs, (re-)billing of customers, and fulfilling other legal requirements related to crossing borders, ranging from environmental standards over goods inspection to general paper work. With the exception of work offered by the World Customs Organization (WCO) the issue of customs and blockchain is still underrepresented in research and practice. In this paper, we look at innovations that drive the current ICTenabled SCM research and how these can be combined with smart customs management. After a literature review and introduction to the state-of-the-art, we list potential trust-based innovations for SCM and customs in digital business ecosystems. Based upon the innovations we also describe a requirements analysis of existing distributed ledger technologies (requirements for system layout, system configuration, system governance). A description of the prototype for the Lake Constance region – on which we are currently working – concludes the paper.