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Transparent laser-structured glasses with superhydrophilic properties for anti-fogging applications
(2019)
Ultrashort pulse laser structuring enables direct modification of glass surfaces to generate superhydrophilic properties for anti-fogging applications. This approach makes coatings dispensable and the generated surfaces remain thermally, mechanically, and chemically resistant. However, the laser-generated structures usually cause scattering, which decreases transmission and may disturb the vision through the modified glass in the dry state. The aim of this study was to find a laser-processing strategy to achieve superhydrophilic, anti-fogging properties on glass surfaces with maximum transmission and minimal visual perception of the generated structure. For this purpose, we used an ultrashort-pulsed laser to generate periodic patterns of rippled circles or rough holes with varying pitch. The water contact angle and transmission of the structured glasses were measured as a function of the structured area. It was found that a periodic pattern of holes, which covers less than 1% of the surface, is already sufficient to reach the superhydrophilic state (contact angle < 5°) and provides nearly the same transmission as pristine glass. Pictures of objects imaged through dry, structured glasses, which were placed close to the lens or object, showed in both cases only a minimal decrease of contrast. If this minor drawback can be accepted, this direct laser structuring approach could be an interesting alternative to coating-based techniques and leaves even room to apply additional coatings for the fabrication of multi-functional special glasses.
In this thesis the effect of dc voltage bias on the equivalent series resistance (ESR) of capacitors and especially ferroelectric dielectric ceramic capacitors (FDCC) is analysed. Further the influence of the dc biased ESR on the losses of capacitors is investigated. Also piezoelectric resonances (PR) occurring in FDCCs with applied dc bias and their influence on the losses are analysed.
Therefore a measurement circuit to measure the impedance and thus the ESR of capacitors in combination with a vector network analyser (VNA) is developed. Using the developed circuit the ESR of capacitors of different technologies is measured and their behaviour with dc bias is evaluated. The losses of an FDCC are measured in a power electronic (PE) circuit with a developed calorimetric measurement system (CMS). The influence of the PR is investigated by tuning the switching frequency of the PE system and thus the frequency of the capacitor current exactly into the PR. The measured losses are then compared to a calculation based on the capacitor current harmonics and the respective ESR.
The measurements show an increase of the ESR with dc bias for all measured FDCCs. The loss measurements show a significant increase of the losses in an FDCC if the current frequency matches the PR frequency. Consequently a decrease of the PE system's efficiency is measured. The loss calculations do not exactly match the measurements but there is a systematic deviation of the same order for all measurements.
In this study, we carried out the structural and thermal characterization of a medical-grade poly (lactide) (PLA) by SEC, TGA, DSC, NMR, ICP-MS and Py-GC/MS. Moreover, we investigated the laser-induced degradation occurring when ultrashort laser pulses (ULP) were employed to cut extremely thin polymer films prepared by solvent-casting. ULP polymer cutting technology is an interesting manufacturing process for its advantages in potential medical applications. In fact, heat transmission to the region surrounding the cuts is limited, so that the incisions are precise and the effects on the regions around them are small. In this way, the need for post-processing is reduced and ULP cutting becomes interesting for industrial applications. However, degradation induced by ULP may occur and compromise the properties of the polymer samples. To investigate this possibility, portions of PLA films, ultrashort laser cut (ULC) and uncut, were analysed by SEC, DSC, NMR and FTIR. Furthermore, PLA oligomers were studied by ESI-MS. Both SEC and NMR showed a decrease in the molecular weight. FTIR, ESI-MS and NMR spectra revealed the presence of olefin end groups originated from a \beta-H transfer mechanism, induced by heat and/or light (Norrish II mechanism). Additionally, the inspection of the ESI mass spectra highlighted the cleavage of ester bonds related to the Norrish I type mechanism, undetected by the other techniques.
Progress in integrated photonics enables development of integrated photonics circuits with new unique properties, circuits of the future, and overcomes current limits in information and communication technologies. The packaging of photonic integrated circuits is necessary for taking them out of research laboratories into real implementation in the information and communication technology applications.
Telecom optical fibers are still being the best transmission medium of digital data and analogue signals for long distance applications. The effective coupling of optical radiation between telecom optical fiber with ten microns core dimension and photonic integrated circuits optical waveguides with submicron dimensions are necessary. To address these challenges, we present our concept of photonics integrated circuit packaging with radio frequency, direct current and fiber array ports with automated active alignment system.
SiN is a suitable material for fabricating of photonic integrated circuits with middle refractive index contrast for the visible and near infrared spectral region with ultra-low propagation losses. The paper deals with the design and simulation of fiber to SiN chip butt coupler with single step fabrication process without thickness tapering. Coupler is designed for 850 nm band for coupling between strip 0.25 μm × 1.00 μm waveguide and Nufern's 780-OCT single mode optical fiber with core diameter 4.4 μm. The coupling losses simulation results of the two simulation methods finite-difference beam propagation techniques and eigenmode expansion method are compared.