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Was ist zu tun?
(2019)
Chancen zum Lernen nutzen
(2018)
This chapter is about school suspension through a social work lens. Young people like Martin require the collective to belong, to be a member of a group, to realise their social needs. This is the basic requirement of human mental and social stability. Suspension stands in opposition because it legitimises social exclusion and disregards the linkage between the individual and collective (Bunge 2003). This chapter advocates for a whole systems approach to tackle social problems and develop sustainable interventions that facilitate young peoples’ needs realisation at school.
Shaolin Wu Fo Dao – die Synthese japanischer und chinesischer Kampfkunst-Lehre auf der Grundlage zen-buddhistischer Theorie und Praxis ist eine neu geschaffene Disziplin. In dieser Fusion verbinden sich wesentliche Elemente aus Budo und Shaolin (-Wudao), deren traditionellen Körper-Geist-Übungen von Kampftechnik (Bu/Wu) und Meditation (Zen/Chan) als originäre Weg- und Heilslehre (Do/Dao) seit jeher der Persönlichkeits- und spirituellen Entwicklung des Ausübenden dienten.
Hier nun, in der Überwindung alter Grenzen zwischen japanischer und chinesischer Kampfkunstsysteme („hart“ und „weich“), wurde hier nun erstmaligen ein zusammengewachsenes Kampfkunstsystem kreiert, um die beidseits positiven Wirkungen auf den Menschen zu bündeln und – und das ist das Besondere – sie in den Dienst buddhistischer (Butsu, jap.: Buddha / chin. Fo) Psychologie und Psychotherapie zu stellen.
Die Verbindung von Budo mit Shaolin als eigenständiges praktisches Lehrkonzept, allein schon eine „revolutionäre Innovation“, erfährt durch ihren Einsatz als spezielle Methode einer Heilkunst zusätzlich Pioniercharakter in der Behandlung von Leid. Gemeint sind sowohl Ansätze aus der Budopädagogik und speziellen Budotherapie zur Heilung, Linderung oder Prävention von physischen, psychosomatischen und psychischen Krisen, Störungen, Krankheiten, Behinderungen und Leiden, als auch im Sinne des philosophischen und wissenschaftlichen Buddhismus, „das Leid in der Welt zu mindern“, zum Wohle des Menschen, für sein Glück und Frieden zu arbeiten.
Smart Room Visualisierung
(2010)
Investigations of the damage mechanisms during ultrashort pulse laser ablation of dental tissue
(2015)
On the integration of intelligent logistics ecosystems in production and industry 4.0 settings
(2017)
The role of entrepreneurs and intrapreneurs in the current zeitgeist is to drive innovation, re-shape rigid, established processes in business as well as for consumers. They use new viewpoints to pioneer new (business) models which focus on ‘smartness’ rather than the purely monetary and short-sighted models of yesteryear. Fostering and supporting the culture of this current zeitgeist is a mayor challenge for entre- and intrapreneurial support infrastructures, namely startup centres and innovation hubs of universities and other public institutions as well as innovation centres of private companies. Hereby, support may range from access to funding over provision of resources such as offices or computing hardware to coaching in the development of business ideas and strategic roadmaps for product and service deployment. In this paper, we focus on describing the status-quo of afore- mentioned support infrastructures in Vorarlberg and the Lake Constance region, then extend the scope to existing (international) approaches for aiding founders and inno- vators in the development of smart services. An analysis of success stories of the Vorarlberg startup centre ‘startupstube’ and other initiatives including their compar- ison to international counterparts builds the basis for a methodological framework for (service science) coaching in entre- and intrapreneurial support infrastructures. The paper is concluded by the description of a framework for choosing the right methods and tools to create service value in entre-/intrapreneurship based upon tested, proven know-how and for defining support infrastructure needs based upon pre-defined stakeholder and target groups as well as the (industry) sectors of the innovators.
The design and development of smart products and services with data science enabled solutions forms a core topic of the current trend of digitalisation in industry. Enabling skilled staff, employees, and students to use data science in their daily work routine of designing such products and services is a key concern of higher education institutions, including universities, company workshop providers and in further education. The scope and usage scenario of this paper is to assess software modules (‘tools’) for integrated data and analytics as service (DAaaS). The tools are usually driven by machine learning, may be deployed in cloud infrastructures, and are specifically targeted at particular needs of the industrial manufacturing, production, or supply chain sector.
The paper describes existing theories and previous work, namely methods used in didactics, work done for visually designing and using machine learning algorithms (no-code / low- code tools), as well as combinations of these two topics. For tools available on the market, an extended assessment of their suitability for a set of learning scenarios and personas is discussed.
Daten im B2B-Ökosystem teilen und nutzen: Wie KMU Voraussetzungen schaffen und Hürden überwinden
(2024)
«Big Data» haben ein großes Potenzial, um die Wertschöpfung effizienter zu gestalten oder um Innovationen hervorzubringen. Daten werden oft an der Schnittstelle zwischen mehreren Akteuren in Business-to-Business-Ökosystemen generiert und sie müssen zwischen den Akteuren geteilt werden. Unternehmen tun sich jedoch schwer damit, Daten in Werte zu transferieren und die Daten im Ökosystem zu teilen. Ursächlich sind weniger technische Gründe als organisationale Rahmenbedingungen. Der Beitrag identifiziert fünf Perspektiven, die Hürden und Voraussetzungen in diesem Prozess darstellen: (1) eine datengetriebene Organisationskultur, (2) Vertrauen zwischen den Akteuren, (3) die Konkretisierung des Wertes von Daten, (4) Datensicherheit und (5) rechtliche und Governance-Aspekte. Eine Fallstudie eines typischen Daten-Ökosystems um ein produzierendes KMU konkretisiert diese Voraussetzungen und Hürden. Es zeigt sich, dass sich Unternehmen, die Daten im Ökosystem teilen möchten, ganzheitlich verändern müssen.
With the emergence of the recent Industry 4.0 movement, data integration is now also being driven along the production line, made possible primarily by the use of established concepts of intelligent supply chains, such as the digital avatars. Digital avatars – sometimes also called Digital Twins or more broadly Cyber-Physical Systems (CPS) – are already successfully used in holistic systems for intelligent transport ecosystems, similar to the use of Big Data and artificial intelligence technologies interwoven with modern production and supply chains. The goal of this paper is to describe how data from interwoven, autonomous and intelligent supply chains can be integrated into the diverse data ecosystems of the Industry 4.0, influenced by a multitude of data exchange formats and varied data schemas. In this paper, we describe how a framework for supporting SMEs was established in the Lake Constance region and describe a demonstrator sprung from the framework. The demonstrator project’s goal is to exhibit and compare two different approaches towards optimisation of manufacturing lines. The first approach is based upon static optimisation of production demand, i.e. exact or heuristic algorithms are used to plan and optimise the assignment of orders to individual machines. In the second scenario, we use real-time situational awareness – implemented as digital avatar – to assign local intelligence to jobs and raw materials in order to compare the results to the traditional planning methods of scenario one. The results are generated using event-discrete simulation and are compared to common (heuristic) job scheduling algorithms.
On the extension of digital ecosystems for SCM and customs with distributed ledger technologies
(2019)
Global supply chains represent the backbone of the modern manufacturing industry. Planning of global supply chains still represents a major hurdle, mainly because of the high complexity and unforeseen disruptions that have to be mastered for meeting the different logistics windows in a globally distributed production environment. Trust in supply chains is an additional challenge. A major – albeit sometimes overlooked - part of Supply Chain Management (SCM) is the management and integration of customs processes, clearing of tariffs, (re-)billing of customers, and fulfilling other legal requirements related to crossing borders, ranging from environmental standards over goods inspection to general paper work. With the exception of work offered by the World Customs Organization (WCO) the issue of customs and blockchain is still underrepresented in research and practice. In this paper, we look at innovations that drive the current ICTenabled SCM research and how these can be combined with smart customs management. After a literature review and introduction to the state-of-the-art, we list potential trust-based innovations for SCM and customs in digital business ecosystems. Based upon the innovations we also describe a requirements analysis of existing distributed ledger technologies (requirements for system layout, system configuration, system governance). A description of the prototype for the Lake Constance region – on which we are currently working – concludes the paper.
In this work, parametric excitation is introduced in a fully balanced flexible rotor mounted on two identical active gas foil bearings. The active gas foil bearings change the top foil shape harmonically with a specific amplitude and frequency. The deformable foil shape is approximated by an analytical function, while the gas pressure distribution is evaluated by the numerical solution of the Reynolds equation for compressible flow. The harmonic variation of the foil shape generates a respective variation in the bearings’ stiffness and damping properties and the system experiences parametric resonances and antiresonances in specific excitation frequencies. The nonlinear gas bearing forces generate bifurcations in the solutions of the system at certain rotating speeds and excitation frequencies; period doubling and Neimark-Sacker bifurcations are noticed in the examined system, and their progress is evaluated as the two bifurcation parameters (rotating speed and parametric excitation frequency) are changed, though a codimension-2 numerical continuation of limit cycles. It is found that at specific range of excitation frequency there are parametric anti-resonances and the bifurcations collide and vanish. Therefore, a bifurcation-free operating range is established and the system can operate stable at a wide speed range.
Compression of ultrashort laser pulses via gated multiphoton intrapulse interference phase scans
(2014)
The paper deals with the optimization of 2x2 optical switch for photonic integrated circuits based on two 2x2 MMI splitters and two phase-modulators. The optical switch was modelled in the RSoftCAD with the simulation tool BeamPROP. The optimization was done to minimise the insertion losses and broaden the spectral band at 1550 nm by using linear tapers in a 2x2 MMI splitter topology. The 2x2 optical switch is a common element for creating more complex 1xN or NxN optical switches in all-optical signal processing.
The paper deals with designing and numerical modelling a 2 x 2 optical switch for photonic integrated circuits based on 2 x 2 MMI elements and phase modulators. The 2 x 2 optical switch was modelled in the RsoftCAD with the simulation tool BeamPROP. The 2 x 2 optical switch is a common element for creating more complex 1 x N or N x N optical switches in all-optical signal processing.
In this paper we report on the experimental test set-up for the temperature characterization of fiber array to photonics chip butt coupling at 1310 nm and 1550 nm wavelengths. The alignment and gluing of fiber arrays to photonics chip were done by automated active alignments system and they were fixed themselves by UV curable epoxy adhesive. Temperature changes of coupling insertion losses are measured and investigated for two different UV adhesives during three temperature cycles from -40 °C to 80 °C in climatic chamber. Spectral dependence of insertion losses was measured and compared before and after three temperature cycles for 1530 nm to 1570 nm spectral range at room temperature.
A Telecom optical fibers are still being the best transmission medium of digital data and analogue signals for long distance applications. Progress in integrated photonics enables development of photonic chips with new unique properties, circuits of the future, and overcomes current limits in information and communication technologies. The packaging of photonic chips is necessary for taking them out of research laboratories into real implementation in the information and communication technology applications. One important step of packaging is effective coupling of optical radiation between telecom optical fiber with ten microns core dimension and photonic chip optical waveguide with submicron dimensions. For complex photonic chips, it is necessary to couple not one optical fiber but several optical fibers, which are arranged in fiber arrays. In this case, it is necessary to use a 6D positioning system, which allows to optimally adjust the relative position of the photonic chip and the fiber arrays. After setting the optimal relative position of the photonic chip and the fiber array, the process of their fixation follows. One possibility of fixation is gluing with an adhesive in the optical path between the photonic chip and an array of optical fibers with a refractive index close to the refractive index of the optical fiber core. This paper is focused on the experimental test set-up for the temperature characterization of fiber array to photonics chip butt coupling at 1310 nm and 1550 nm wavelengths fixed themselves by UV adhesive in the optical path. The main aims of this works are selection of better adhesive from two types for gluing of photonic chip and fiber array in packaging process of photonics chips and validation of gluing process developing. The coupling and alignment of fiber arrays to photonics chip were done by automated active alignments system and they were fixed themselves by curable epoxy adhesive. Temperature changes of coupling insertion losses are measured and investigated for two different UV adhesives during three temperature cycles from -40 °C to 80 °C in climatic chamber according to Telcordia. Spectral dependence of insertion losses were measured and compared before and after three temperature cycles for 1530 nm to 1570 nm spectral range at room temperature.
This work was supported by the Slovak Research and Development Agency under the contracts APVV-17-0662 and SK-AT-20-0017 and by the COST Action “European Network for High Performance Integrated Microwave Photonics” (EUIMWP) CA16220.
The main aims of this work are the validation of the developed process of gluing a single-mode optical fiber array with a photonic chip and the selection of a more suitable adhesive from the two adhesives being compared. An active alignment system was used for adjusting the two optical fiber arrays to a photonics chip. The gluing was done by two compared UV curable adhesives applied in the optical path. The insertion losses of glued coupling were measured and investigated at two discrete wavelengths 1310 nm and 1550 nm during temperature testing in the climatic chamber according to Telcordia GR_1209_Corei04 [3]. The measurement, investigation, and comparison of insertion losses of the glued coupling at the spectral band from 1530 nm to 1570 nm were done immediately after gluing process and after three temperature cycles in the climatic chamber with one month delay.
SiN is a suitable material for fabricating of photonic integrated circuits with middle refractive index contrast for the visible and near infrared spectral region with ultra-low propagation losses. The paper deals with the design and simulation of fiber to SiN chip butt coupler with single step fabrication process without thickness tapering. Coupler is designed for 850 nm band for coupling between strip 0.25 μm × 1.00 μm waveguide and Nufern's 780-OCT single mode optical fiber with core diameter 4.4 μm. The coupling losses simulation results of the two simulation methods finite-difference beam propagation techniques and eigenmode expansion method are compared.
Progress in integrated photonics enables development of integrated photonics circuits with new unique properties, circuits of the future, and overcomes current limits in information and communication technologies. The packaging of photonic integrated circuits is necessary for taking them out of research laboratories into real implementation in the information and communication technology applications.
Telecom optical fibers are still being the best transmission medium of digital data and analogue signals for long distance applications. The effective coupling of optical radiation between telecom optical fiber with ten microns core dimension and photonic integrated circuits optical waveguides with submicron dimensions are necessary. To address these challenges, we present our concept of photonics integrated circuit packaging with radio frequency, direct current and fiber array ports with automated active alignment system.
Effects of hole-transport layer homogeneity in organic solar cells – A multi-length scale study
(2017)
Learning together
(2019)