Refine
Document Type
- Conference Proceeding (22) (remove)
Institute
Language
- English (22)
Is part of the Bibliography
- yes (22)
Keywords
- silicon nitride (3)
- Y-branch splitter (2)
- integrated photonics (2)
- AWG design (1)
- IP-Dip polymer (1)
- MMI splitter (1)
- Y-branch (1)
- arrayed waveguide grating (1)
- arrayed waveguide gratings (1)
- concept (1)
Progress in integrated photonics enables development of integrated photonics circuits with new unique properties, circuits of the future, and overcomes current limits in information and communication technologies. The packaging of photonic integrated circuits is necessary for taking them out of research laboratories into real implementation in the information and communication technology applications.
Telecom optical fibers are still being the best transmission medium of digital data and analogue signals for long distance applications. The effective coupling of optical radiation between telecom optical fiber with ten microns core dimension and photonic integrated circuits optical waveguides with submicron dimensions are necessary. To address these challenges, we present our concept of photonics integrated circuit packaging with radio frequency, direct current and fiber array ports with automated active alignment system.
SiN is a suitable material for fabricating of photonic integrated circuits with middle refractive index contrast for the visible and near infrared spectral region with ultra-low propagation losses. The paper deals with the design and simulation of fiber to SiN chip butt coupler with single step fabrication process without thickness tapering. Coupler is designed for 850 nm band for coupling between strip 0.25 μm × 1.00 μm waveguide and Nufern's 780-OCT single mode optical fiber with core diameter 4.4 μm. The coupling losses simulation results of the two simulation methods finite-difference beam propagation techniques and eigenmode expansion method are compared.
Optical splitters are passive optical components, which have found applications in a wide range of telecom, sensing, medical and many other scientific areas.
Low-index contrast optical splitters (Silica-on-Silicon (SoS) based waveguide devices) feature many advantages such as low fiber coupling losses and low propagation losses. They are considered an attractive DWDM solution in the telecommunication for all optical signal processing in optical communication systems. Nowadays the steadily increasing data volume in communication networks is driven by a rapid proliferation of home-based and business computers, storage capacities, processing capabilities and the extensive availability of Internet. The challenge is to transfer high data volumes in short periods of time over high distances as lossless as possible. The task of the optical splitters in Fiber-to-the-x (FTTx) network is to split one optical signal in many identical signals bringing for example the same TV signal in different households. Of course, the more buildings can be served by one optical splitter the lower are the installation costs.
High-index contrast optical splitters (such as silicon, silicon nitride or polymer based waveguide devices) feature much smaller waveguide size compared to low index contrast splitters. Such compact devices can easily be implemented on-chip and have already been used in the development of optical sensors, devices for DNA diagnostics and for infrared spectroscopy.
We will present the latest achievements in the design of two mostly used optical splitters (MMI and Y-branch) and discuss their advantages and disadvantages. Finally, some applications of the splitters developed in the frame of various projects will be presented.
This work was carried out in the framework of the project PHOCOP (no. SK-AT-2017-0013) and NAMOPRISIN (no. SK-AT-2017-0005) from the Slovak research and development agency of the Ministry of Education, Science, Research and Sport of the Slovak Republic and SK 16/2018 and 15/2018 from OeAD-GmbH.
Comparison of silicon nitride based 1x8 Y-branch splitters applying different waveguide structures
(2019)
This paper presents design, simulation and optimization of 1x8 Y-branch power splitters based on Si/SiO2/SiN/SiOx material platform. For the designs, two different waveguide structures were used, i.e. ridge and rib waveguides. The splitters were designed for 850 nm spectral optical window and the simulations were performed applying FEM and BPM methods in RSoft photonic tool. The aim of this work was to find minimum physical dimensions of the designed splitters occupying minimal space on PIC chip. The optimization was done with regards to high symmetrical splitting ratio and low insertion loss. Finally, the optical properties of both splitters were studied and compared with each other.
Comparison of silicon nitride based 8-channel 100-GHz AWGs applying different waveguide structures
(2019)
This paper presents design and simulation of 8-channel, 100-GHz AWGs based on Si/SiO2/SiN/SiOx material platform. For the designs, two different waveguide structures were used, i.e. ridge and rib waveguides. AWGs were designed for central wavelength of 850 nm applying AWG-Parameters tool. The simulations were performed applying FEM and BPM methods in RSoft and PHASAR photonic tools. The simulation results show considerably lower losses but slightly higher channel crosstalk when applying rib waveguides.
We present design and simulation of 16-channel, 100-GHz silicon nitride based AWG using BeamPROP simulation engine of RSoft photonic tool. The AWG was designed for TM-polarized light with central wavelength of 850 nm. The input design parameters were calculated applying AWG-Parameters tool. For this purpose, we created a ridge waveguide structure, used in the design of the AWG layout, and performed FEM simulation. The output of the BPM simulation of AWG structure are the transmission characteristics, which was used to calculate transmission parameters defining optical properties of simulated AWG. The achieved simulation results are in a good agreement with the design.
The photonic integrated circuits are required in the next generations of coherent terabit optical communications. The software tools for automated adjustment and coupling of optical fiber arrays to photonic integrated circuits has been developed. The obtained results are needed in final production phase in the technology process of photonic integrated circuits packaging.
Introducing 3D sub-micrometer technologies based on polymers opened new possibilities of design and fabrication of photonic devices and components in 3D arrangement. 3D laser lithography is direct writing process based on two photon polymerization exhibiting high accuracy and versatility, where numerous resists and even polymer ceramic mixtures can be used. We present design and simulation of polymer based photonic components with a focus on arrayed waveguide gratings (AWG) based on optical multiplexers/demultiplexers and optical splitters. All optical components were designed for 1550 nm operating wavelength, applying two commercial photonics tools. This study creates a basis for the design of optical components in 3D arrangement, which will be fabricated by 3D laser lithography.