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Progress in integrated photonics enables development of integrated photonics circuits with new unique properties, circuits of the future, and overcomes current limits in information and communication technologies. The packaging of photonic integrated circuits is necessary for taking them out of research laboratories into real implementation in the information and communication technology applications.
Telecom optical fibers are still being the best transmission medium of digital data and analogue signals for long distance applications. The effective coupling of optical radiation between telecom optical fiber with ten microns core dimension and photonic integrated circuits optical waveguides with submicron dimensions are necessary. To address these challenges, we present our concept of photonics integrated circuit packaging with radio frequency, direct current and fiber array ports with automated active alignment system.
SiN is a suitable material for fabricating of photonic integrated circuits with middle refractive index contrast for the visible and near infrared spectral region with ultra-low propagation losses. The paper deals with the design and simulation of fiber to SiN chip butt coupler with single step fabrication process without thickness tapering. Coupler is designed for 850 nm band for coupling between strip 0.25 μm × 1.00 μm waveguide and Nufern's 780-OCT single mode optical fiber with core diameter 4.4 μm. The coupling losses simulation results of the two simulation methods finite-difference beam propagation techniques and eigenmode expansion method are compared.
Optical splitters are passive optical components, which have found applications in a wide range of telecom, sensing, medical and many other scientific areas.
Low-index contrast optical splitters (Silica-on-Silicon (SoS) based waveguide devices) feature many advantages such as low fiber coupling losses and low propagation losses. They are considered an attractive DWDM solution in the telecommunication for all optical signal processing in optical communication systems. Nowadays the steadily increasing data volume in communication networks is driven by a rapid proliferation of home-based and business computers, storage capacities, processing capabilities and the extensive availability of Internet. The challenge is to transfer high data volumes in short periods of time over high distances as lossless as possible. The task of the optical splitters in Fiber-to-the-x (FTTx) network is to split one optical signal in many identical signals bringing for example the same TV signal in different households. Of course, the more buildings can be served by one optical splitter the lower are the installation costs.
High-index contrast optical splitters (such as silicon, silicon nitride or polymer based waveguide devices) feature much smaller waveguide size compared to low index contrast splitters. Such compact devices can easily be implemented on-chip and have already been used in the development of optical sensors, devices for DNA diagnostics and for infrared spectroscopy.
We will present the latest achievements in the design of two mostly used optical splitters (MMI and Y-branch) and discuss their advantages and disadvantages. Finally, some applications of the splitters developed in the frame of various projects will be presented.
This work was carried out in the framework of the project PHOCOP (no. SK-AT-2017-0013) and NAMOPRISIN (no. SK-AT-2017-0005) from the Slovak research and development agency of the Ministry of Education, Science, Research and Sport of the Slovak Republic and SK 16/2018 and 15/2018 from OeAD-GmbH.
Comparison of silicon nitride based 1x8 Y-branch splitters applying different waveguide structures
(2019)
This paper presents design, simulation and optimization of 1x8 Y-branch power splitters based on Si/SiO2/SiN/SiOx material platform. For the designs, two different waveguide structures were used, i.e. ridge and rib waveguides. The splitters were designed for 850 nm spectral optical window and the simulations were performed applying FEM and BPM methods in RSoft photonic tool. The aim of this work was to find minimum physical dimensions of the designed splitters occupying minimal space on PIC chip. The optimization was done with regards to high symmetrical splitting ratio and low insertion loss. Finally, the optical properties of both splitters were studied and compared with each other.