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In this paper, design of 1×8 multimode interference passive optical splitter is proposed. The structure of the splitter is designed based on a silicon nitride material platform. This work aims to find the minimum physical dimensions of the designed splitters with the satisfactory optical performance. According to the minimum insertion loss and minimum non-uniformity, the optimum length of the splitters is determined.
This paper presents the design, simulation, and optimization of a 1×128 multimode interference (MMI) splitter with a silica-on-silicon channel profile. This work aims to study the influence of the different S-Bend output waveguide shapes at the end of the MMI coupler on the final optical properties. The 1×128 MMI splitters have been simulated using beam propagation method in OptiBPM software. The optical properties of all considered splitters with different shapes of outputs waveguides are discussed and compared with each other. Based on the minimum insertion loss and non-uniformity, the final shape of output waveguides, ensuring the lowest losses, is determined.
We present design, simulation and optimization of polymer based 16-channel, 100-GHz AWG designed for central wavelength of 1550 nm. The input design parameters were calculated applying AWG-Parameters tool. The simulations were performed applying a commercial photonic tool PHASAR from Optiwave. The achieved transmission characteristics were evaluated by AWG-Analyzer tool and show a satisfying agreement between designed and simulated AWG optical properties. Finally, the influence of the number of phased array (PA) waveguides on the AWG performance was studied. The results show that there is a certain minimum number of PA waveguides necessary to reach sufficient AWG performance.
In this paper we report on the experimental test set-up for the temperature characterization of fiber array to photonics chip butt coupling at 1310 nm and 1550 nm wavelengths. The alignment and gluing of fiber arrays to photonics chip were done by automated active alignments system and they were fixed themselves by UV curable epoxy adhesive. Temperature changes of coupling insertion losses are measured and investigated for two different UV adhesives during three temperature cycles from -40 °C to 80 °C in climatic chamber. Spectral dependence of insertion losses was measured and compared before and after three temperature cycles for 1530 nm to 1570 nm spectral range at room temperature.
Progress in integrated photonics enables development of integrated photonics circuits with new unique properties, circuits of the future, and overcomes current limits in information and communication technologies. The packaging of photonic integrated circuits is necessary for taking them out of research laboratories into real implementation in the information and communication technology applications.
Telecom optical fibers are still being the best transmission medium of digital data and analogue signals for long distance applications. The effective coupling of optical radiation between telecom optical fiber with ten microns core dimension and photonic integrated circuits optical waveguides with submicron dimensions are necessary. To address these challenges, we present our concept of photonics integrated circuit packaging with radio frequency, direct current and fiber array ports with automated active alignment system.
SiN is a suitable material for fabricating of photonic integrated circuits with middle refractive index contrast for the visible and near infrared spectral region with ultra-low propagation losses. The paper deals with the design and simulation of fiber to SiN chip butt coupler with single step fabrication process without thickness tapering. Coupler is designed for 850 nm band for coupling between strip 0.25 μm × 1.00 μm waveguide and Nufern's 780-OCT single mode optical fiber with core diameter 4.4 μm. The coupling losses simulation results of the two simulation methods finite-difference beam propagation techniques and eigenmode expansion method are compared.