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A Telecom optical fibers are still being the best transmission medium of digital data and analogue signals for long distance applications. Progress in integrated photonics enables development of photonic chips with new unique properties, circuits of the future, and overcomes current limits in information and communication technologies. The packaging of photonic chips is necessary for taking them out of research laboratories into real implementation in the information and communication technology applications. One important step of packaging is effective coupling of optical radiation between telecom optical fiber with ten microns core dimension and photonic chip optical waveguide with submicron dimensions. For complex photonic chips, it is necessary to couple not one optical fiber but several optical fibers, which are arranged in fiber arrays. In this case, it is necessary to use a 6D positioning system, which allows to optimally adjust the relative position of the photonic chip and the fiber arrays. After setting the optimal relative position of the photonic chip and the fiber array, the process of their fixation follows. One possibility of fixation is gluing with an adhesive in the optical path between the photonic chip and an array of optical fibers with a refractive index close to the refractive index of the optical fiber core. This paper is focused on the experimental test set-up for the temperature characterization of fiber array to photonics chip butt coupling at 1310 nm and 1550 nm wavelengths fixed themselves by UV adhesive in the optical path. The main aims of this works are selection of better adhesive from two types for gluing of photonic chip and fiber array in packaging process of photonics chips and validation of gluing process developing. The coupling and alignment of fiber arrays to photonics chip were done by automated active alignments system and they were fixed themselves by curable epoxy adhesive. Temperature changes of coupling insertion losses are measured and investigated for two different UV adhesives during three temperature cycles from -40 °C to 80 °C in climatic chamber according to Telcordia. Spectral dependence of insertion losses were measured and compared before and after three temperature cycles for 1530 nm to 1570 nm spectral range at room temperature.
This work was supported by the Slovak Research and Development Agency under the contracts APVV-17-0662 and SK-AT-20-0017 and by the COST Action “European Network for High Performance Integrated Microwave Photonics” (EUIMWP) CA16220.
The paper deals with designing and numerical modelling a 2 x 2 optical switch for photonic integrated circuits based on 2 x 2 MMI elements and phase modulators. The 2 x 2 optical switch was modelled in the RsoftCAD with the simulation tool BeamPROP. The 2 x 2 optical switch is a common element for creating more complex 1 x N or N x N optical switches in all-optical signal processing.
In this paper, the design of three-dimensional configuration of Y-branch splitter is compared with Multimode Interference splitter. Both splitters use the IP-Dip polymer as a standard material for 3D laser lithography. The optical properties of the splitters for both approaches are discussed and compared.
This paper presents design, simulation, and optimization of the three-dimensional 1×4 optical multimode interference splitter using IP-Dip polymer as a core and polydimethylsiloxane (PDMS) Sylgard 184 as a cladding. The splitter was simulated by using beam propagation method in BeamPROP simulation engine of RSoft photonic tool and optimized for an operating wavelength of 1.55 µm. According to the minimum insertion loss, the dimensions of the MMI coupler and the length of the whole MMI splitter structure were optimized applying a waveguide with a core size of 4×4 µm2. The objective of the study is to create a design for fabrication by three-dimensional direct laser writing optical lithography.
Design and optimization of 1x2N Y-branch optical splitters for telecommunication applications
(2020)
This paper presents the design and optimization of 1x2N Y-branch optical splitters for telecom applications. A waveguide channel profile, used in the splitter design, is based on a standard silica-on-silicon material platform. Except for the lengths of the used Y-branches, design parameters such as port pitch between the waveguides and simulation parameters for all splitters were considered fixed. For every Y-branch splitter, insertion loss, non-uniformity, and background crosstalk are calculated. According to the minimum insertion loss and minimum non-uniformity, the optimum length for each Y-branch is determined. Finally, the individual Y-branches are cascade joined to design various Y-branch optical splitters, from 1x2 to 1x64.
In this paper, low-loss Y-branch splitters up to 128 splitting ratio are designed, simulated, and optimized by using 2D beam propagation method in OptiBPM tool by Optiwave. For an optical waveguide, a silica-on-silicon material platform is used. The splitters were designed as a planar structure for a telecommunication operating wavelength of 1.55 m. According to the minimum insertion loss and minimum non-uniformity, the optimum length for each Y-branch is determined. The influence of the pre-defined S-Bend waveguide shapes (Arc, Cosine, Sine) and of the waveguide core size reduction on the splitter performance has been also studied. The obtained simulation results of all designed splitters with different S-Bend shape waveguides together with the different waveguide core sizes are discussed and compared with each other.
This paper aims to study the design, simulation, and optimization of low-loss Y-branch passive optical splitters up to 64 output ports for telecommunication applications. For a waveguide channel profile, the standard material silica-on-silicon is used. The Y-splitters are designed and simulated at telecommunication operating wavelength, λ = 1550 nm. Except for the lengths of the used Y-branches, and a core size of the waveguides, design parameters such as port pitch between the waveguides and simulation parameters for all splitters are considered fixed. The simulation results are analyzed to determine the optimum length of the splitters and the optimum core size. Based on this optimization the total length of the highest designed 1×64 Y-branch splitter was reduced by 41.14 % for a waveguide core (5×5) μm2 compared to the length of splitter with a standard (6×6) μm2 core size.