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In this paper, low-loss Y-branch splitters up to 128 splitting ratio are designed, simulated, and optimized by using 2D beam propagation method in OptiBPM tool by Optiwave. For an optical waveguide, a silica-on-silicon material platform is used. The splitters were designed as a planar structure for a telecommunication operating wavelength of 1.55 m. According to the minimum insertion loss and minimum non-uniformity, the optimum length for each Y-branch is determined. The influence of the pre-defined S-Bend waveguide shapes (Arc, Cosine, Sine) and of the waveguide core size reduction on the splitter performance has been also studied. The obtained simulation results of all designed splitters with different S-Bend shape waveguides together with the different waveguide core sizes are discussed and compared with each other.
A Telecom optical fibers are still being the best transmission medium of digital data and analogue signals for long distance applications. Progress in integrated photonics enables development of photonic chips with new unique properties, circuits of the future, and overcomes current limits in information and communication technologies. The packaging of photonic chips is necessary for taking them out of research laboratories into real implementation in the information and communication technology applications. One important step of packaging is effective coupling of optical radiation between telecom optical fiber with ten microns core dimension and photonic chip optical waveguide with submicron dimensions. For complex photonic chips, it is necessary to couple not one optical fiber but several optical fibers, which are arranged in fiber arrays. In this case, it is necessary to use a 6D positioning system, which allows to optimally adjust the relative position of the photonic chip and the fiber arrays. After setting the optimal relative position of the photonic chip and the fiber array, the process of their fixation follows. One possibility of fixation is gluing with an adhesive in the optical path between the photonic chip and an array of optical fibers with a refractive index close to the refractive index of the optical fiber core. This paper is focused on the experimental test set-up for the temperature characterization of fiber array to photonics chip butt coupling at 1310 nm and 1550 nm wavelengths fixed themselves by UV adhesive in the optical path. The main aims of this works are selection of better adhesive from two types for gluing of photonic chip and fiber array in packaging process of photonics chips and validation of gluing process developing. The coupling and alignment of fiber arrays to photonics chip were done by automated active alignments system and they were fixed themselves by curable epoxy adhesive. Temperature changes of coupling insertion losses are measured and investigated for two different UV adhesives during three temperature cycles from -40 °C to 80 °C in climatic chamber according to Telcordia. Spectral dependence of insertion losses were measured and compared before and after three temperature cycles for 1530 nm to 1570 nm spectral range at room temperature.
This work was supported by the Slovak Research and Development Agency under the contracts APVV-17-0662 and SK-AT-20-0017 and by the COST Action “European Network for High Performance Integrated Microwave Photonics” (EUIMWP) CA16220.
This paper presents design, simulation, and optimization of the three-dimensional 1×4 optical multimode interference splitter using IP-Dip polymer as a core and polydimethylsiloxane (PDMS) Sylgard 184 as a cladding. The splitter was simulated by using beam propagation method in BeamPROP simulation engine of RSoft photonic tool and optimized for an operating wavelength of 1.55 µm. According to the minimum insertion loss, the dimensions of the MMI coupler and the length of the whole MMI splitter structure were optimized applying a waveguide with a core size of 4×4 µm2. The objective of the study is to create a design for fabrication by three-dimensional direct laser writing optical lithography.
In this work, we investigated the influence of different etch depths of the rib waveguides on the performance of SiN-based AWGs. For this purpose, an 8-channel 100 GHz AWG was designed for a center wavelength of 850 nm. The design parameters entered were calculated using the AWG-Parameters tool. The simulations were performed with a commercial photonic tool PHASAR from Optiwave. The simulated performance was evaluated using the AWG-Analyzer tool. For the AWG design, we used three identical rib waveguides with different etch depths to simulate possible etch imperfection. The simulations show the wavelength shift and degradation of the AWG performance.
We present design of planar 16-channel, 100-GHz multi-mode polymer-based AWG. This AWG was designed for central wavelength of 1550 nm applying AWG-Parameters tool. The AWG structure was created and simulated in the commercial photonic tool PHASAR from Optiwave. Achieved transmission characteristics were evaluated by AWG-Analyzer tool. For the design, multi-mode waveguides having a cross-section of (4x4) µm2 were used. The simulated results show strong worsening of the transmission characteristics in comparison when using single-mode waveguides. Nevertheless, the transmitting channels are clearly separated. The reason for using thicker multi-mode waveguides in the design is possibility to fabricate the AWG structure on polymer basis using direct laser writing lithography.
This paper aims to study the design, simulation, and optimization of low-loss Y-branch passive optical splitters up to 64 output ports for telecommunication applications. For a waveguide channel profile, the standard material silica-on-silicon is used. The Y-splitters are designed and simulated at telecommunication operating wavelength, λ = 1550 nm. Except for the lengths of the used Y-branches, and a core size of the waveguides, design parameters such as port pitch between the waveguides and simulation parameters for all splitters are considered fixed. The simulation results are analyzed to determine the optimum length of the splitters and the optimum core size. Based on this optimization the total length of the highest designed 1×64 Y-branch splitter was reduced by 41.14 % for a waveguide core (5×5) μm2 compared to the length of splitter with a standard (6×6) μm2 core size.
Design and optimization of 1x2N Y-branch optical splitters for telecommunication applications
(2020)
This paper presents the design and optimization of 1x2N Y-branch optical splitters for telecom applications. A waveguide channel profile, used in the splitter design, is based on a standard silica-on-silicon material platform. Except for the lengths of the used Y-branches, design parameters such as port pitch between the waveguides and simulation parameters for all splitters were considered fixed. For every Y-branch splitter, insertion loss, non-uniformity, and background crosstalk are calculated. According to the minimum insertion loss and minimum non-uniformity, the optimum length for each Y-branch is determined. Finally, the individual Y-branches are cascade joined to design various Y-branch optical splitters, from 1x2 to 1x64.