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A Telecom optical fibers are still being the best transmission medium of digital data and analogue signals for long distance applications. Progress in integrated photonics enables development of photonic chips with new unique properties, circuits of the future, and overcomes current limits in information and communication technologies. The packaging of photonic chips is necessary for taking them out of research laboratories into real implementation in the information and communication technology applications. One important step of packaging is effective coupling of optical radiation between telecom optical fiber with ten microns core dimension and photonic chip optical waveguide with submicron dimensions. For complex photonic chips, it is necessary to couple not one optical fiber but several optical fibers, which are arranged in fiber arrays. In this case, it is necessary to use a 6D positioning system, which allows to optimally adjust the relative position of the photonic chip and the fiber arrays. After setting the optimal relative position of the photonic chip and the fiber array, the process of their fixation follows. One possibility of fixation is gluing with an adhesive in the optical path between the photonic chip and an array of optical fibers with a refractive index close to the refractive index of the optical fiber core. This paper is focused on the experimental test set-up for the temperature characterization of fiber array to photonics chip butt coupling at 1310 nm and 1550 nm wavelengths fixed themselves by UV adhesive in the optical path. The main aims of this works are selection of better adhesive from two types for gluing of photonic chip and fiber array in packaging process of photonics chips and validation of gluing process developing. The coupling and alignment of fiber arrays to photonics chip were done by automated active alignments system and they were fixed themselves by curable epoxy adhesive. Temperature changes of coupling insertion losses are measured and investigated for two different UV adhesives during three temperature cycles from -40 °C to 80 °C in climatic chamber according to Telcordia. Spectral dependence of insertion losses were measured and compared before and after three temperature cycles for 1530 nm to 1570 nm spectral range at room temperature.
This work was supported by the Slovak Research and Development Agency under the contracts APVV-17-0662 and SK-AT-20-0017 and by the COST Action “European Network for High Performance Integrated Microwave Photonics” (EUIMWP) CA16220.
The main aims of this work are the validation of the developed process of gluing a single-mode optical fiber array with a photonic chip and the selection of a more suitable adhesive from the two adhesives being compared. An active alignment system was used for adjusting the two optical fiber arrays to a photonics chip. The gluing was done by two compared UV curable adhesives applied in the optical path. The insertion losses of glued coupling were measured and investigated at two discrete wavelengths 1310 nm and 1550 nm during temperature testing in the climatic chamber according to Telcordia GR_1209_Corei04 [3]. The measurement, investigation, and comparison of insertion losses of the glued coupling at the spectral band from 1530 nm to 1570 nm were done immediately after gluing process and after three temperature cycles in the climatic chamber with one month delay.
In this paper we report on the experimental test set-up for the temperature characterization of fiber array to photonics chip butt coupling at 1310 nm and 1550 nm wavelengths. The alignment and gluing of fiber arrays to photonics chip were done by automated active alignments system and they were fixed themselves by UV curable epoxy adhesive. Temperature changes of coupling insertion losses are measured and investigated for two different UV adhesives during three temperature cycles from -40 °C to 80 °C in climatic chamber. Spectral dependence of insertion losses was measured and compared before and after three temperature cycles for 1530 nm to 1570 nm spectral range at room temperature.
Parametric anti-resonance is a phenomenon that occurs in systems with at least two degrees of freedom; this can be achieved by periodically exciting some parameters of the system. The effect of this properly tuned periodicity is to increase the dissipation in the system, which leads to a raising in the effective damping of vibrations. This contribution presents the design of an open-loop control to reduce the settling time using the anti-resonance concept. The control signal consists of a quasi-periodic signal capable of transferring the system’s oscillations from one mode to another mode of the system. The general averaging technique is used to characterize the dynamics, particularly the so-called slow dynamics of motion. With this analysis, the control signal is designed for the potential application of a microelectromechanical sensor arrangement; for this specific example, up to 96.8% reduction of settling time is achieved.