Forschungszentrum Mikrotechnik
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Modern portable electronic devices have seen component heat load increasing, while the space available for heat dissipation has decreased. This requires the thermal management system to be optimized to attain the high performance heat sink. Heat sinks plays a major role for dissipating heat in electronic devices. Phase change material (PCM) is used to enhance the heat dissipation in heat sink. This paper reports the results of an experimental investigation of the performance of Pin fin heat sinks filled with phase change materials for thermal management of electronic devices. The experimental set ups are prepared with the graphical programming language with Lab VIEW (Laboratory Virtual Instruments for Engineering Workbench. Three different types of Pin fin Heat sink with and without PCM are investigated based on different operational timings and the temperature is acquired with the help of Data Acquisition Card (DAQ). The results indicated that the inclusion of the PCM could stabilize the temperature for a longer period and reduce the heating rates and peak temperatures of heat sink with increasing the number of fins can enhance the thermal performance of electronic devices.
Silicon nanophotonics
(2013)
Design and simulation of 128-channel 10 GHz AWG for ultra-dense wavelength division multiplexing
(2012)
We have demonstrated micromachining of bulk 3C silicon carbide (3C- SiC) wafers by employing 1028nm wavelength femtosecond laser pulses of energy less than 10 nJ directly from a femtosecond laser oscillator, thus eliminating the need for an amplified system and increasing the micromachining speed by more than four orders of magnitude.
We have investigated the ablation behaviour of single crystal SrTiO3 <100> with focus on the influence of the pulse duration at a wavelength of 248 nm. The experiments were performed with KrF-excimer lasers with pulse durations of 34 ns and 500 fs, respectively. Femtosecond-ablation turns out to be more efficient by one order of magnitude and to eliminate the known problem of cracking of SrTiO3 during laser machining with longer pulses. In addition, the cavities ablated with femtosecond pulses display a smoother surface with no indication of melting and well-defined, sharp edges. These effects can be explained by the reduced thermal shock effect on the material by using ultrashort pulses.