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Mit Eintritt in den ersten Covid-19-Lockdown im März 2020 und den darauffolgenden Semestern im überwiegenden Distance-Betrieb, wurde ein nie dagewesenes didaktisches Experiment gestartet. Eine seit 2017 abgehaltenen Lehrveranstaltung im Bachelorstudiengang Internationale Betriebswirtschaft an der Fachhochschule Vorarlberg simulierte bereits in "Vor-Pandemie-Semestern" das Arbeiten und Interagieren in virtuellen Teams. Die hieraus vorliegenden Reflexionsberichte ergeben zusammen mit den Hausarbeiten, welche die Studierenden der Lehrveranstaltung in 2020 im Lichte eines kompletten Online Semesters in virtuellen Teams erstellt haben die Basis für sieben Thesen zur Auswirkung einer digitalen und virtuellen Zusammenarbeit für Ausbildung und Berufstätigkeit.
With the digitalisation, and the increased connectivity between manufacturing systems emerging in this context, manufacturing is shifting towards decentralised, distributed concepts. Still, for manufacturing scenarios manual input or augmentation of data is required at system boundaries. Especially in distributed manufacturing environments, like Cloud Manufacturing (CMfg) systems, constant changes to the available manufacturing resources and products pose challenges for establishing connections between them. We propose a feature-oriented representation of concepts, especially from the manufacturing domain, which serves as the basis for (semi-) automatically linking, e.g., manufacturing resources and products. This linking methodologies, as well as knowledge inferred using it, is then used to support distributed manufacturing, especially in CMfg environments, and enhance product development. The concepts and methodologies are to be evaluated in a real world learning factory.
Femtosecond laser ablation on Si generates 2D ripple structures, known as laser induced periodic surface structures (LIPSS) and pinholes. We fabricated membranes with 20 to 50 μm thickness perforated by an array of tapered pinholes up to 5 μm in diameter and 10 to 20 μm spacing. Within several micrometer the pinholes transform into hollow photonic waveguides with constant diameter from 1μm to 2μm. Such structures offer a 3D photonic coupling device for polymer Y-branch- and MMI-splitter. We measured a considerable change of electrical resistivity for 500 ppm H2 in air using Si/SiO2/TiO2 substrates with 2D LIPSS. We propose to investigate 3D waveguide arrays also for photonic-chemical sensors.
In this paper, design of 1×8 multimode interference passive optical splitter is proposed. The structure of the splitter is designed based on a silicon nitride material platform. This work aims to find the minimum physical dimensions of the designed splitters with the satisfactory optical performance. According to the minimum insertion loss and minimum non-uniformity, the optimum length of the splitters is determined.
This paper presents the design, simulation, and optimization of a 1×128 multimode interference (MMI) splitter with a silica-on-silicon channel profile. This work aims to study the influence of the different S-Bend output waveguide shapes at the end of the MMI coupler on the final optical properties. The 1×128 MMI splitters have been simulated using beam propagation method in OptiBPM software. The optical properties of all considered splitters with different shapes of outputs waveguides are discussed and compared with each other. Based on the minimum insertion loss and non-uniformity, the final shape of output waveguides, ensuring the lowest losses, is determined.
We present design, simulation and optimization of polymer based 16-channel, 100-GHz AWG designed for central wavelength of 1550 nm. The input design parameters were calculated applying AWG-Parameters tool. The simulations were performed applying a commercial photonic tool PHASAR from Optiwave. The achieved transmission characteristics were evaluated by AWG-Analyzer tool and show a satisfying agreement between designed and simulated AWG optical properties. Finally, the influence of the number of phased array (PA) waveguides on the AWG performance was studied. The results show that there is a certain minimum number of PA waveguides necessary to reach sufficient AWG performance.
In this paper we report on the experimental test set-up for the temperature characterization of fiber array to photonics chip butt coupling at 1310 nm and 1550 nm wavelengths. The alignment and gluing of fiber arrays to photonics chip were done by automated active alignments system and they were fixed themselves by UV curable epoxy adhesive. Temperature changes of coupling insertion losses are measured and investigated for two different UV adhesives during three temperature cycles from -40 °C to 80 °C in climatic chamber. Spectral dependence of insertion losses was measured and compared before and after three temperature cycles for 1530 nm to 1570 nm spectral range at room temperature.