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Abstract: ams AG is a leading provider of sensing solutions developing semiconductor sensors in a wide variety of fields, with optical sensing as one of the key competences. Since integrated photonics is a promising technology for new sensor systems, ams AG has been developing processes for fully integrated CMOS-compatible photonic components based on Si3N4. This talk will provide an overview on the processing of basic photonic building blocks and their optical properties and performance. We will also give examples for applications in the fields of optical coherence tomography and opto-chemical gas sensing. In the 1980s photonics started its way for common use in telecommunication technology, using optical fiber technologies. In recent years, also a variety of photonic sensors has been proposed and developed. One of the major drawbacks of most of these photonic devices has been the lack of integration into existing (semiconductor) production processes, so far. This integration is feasible using SiN material systems to process monolithically integrated CMOS-compatible photonic sensors in the visible and near-infrared spectrum. We will present the basic processing steps for the SiN photonic technology, the development of some critical processing steps such as SiN deposition and SiN etching as well as several photonic components (waveguides, splitters, etc.) with their optical properties. One of the applications presented relates to optical coherence tomography (OCT), a fast growing imaging technique in ophthalmology. Drawbacks of existing OCT systems are their high costs as well as their bulkiness, which prevents a wider spread use of OCT systems.
One way to overcome both cost and size issues is to integrate optical and electrical components on a single chip.
Part of this work was carried out in the framework of the projects COHESION (funded by the Austrian Research Promotion Agency (FFG), no. 848588), OCTCHIP (funded by the EU’ Horizon 2020 research and innovation programme, no. 688173), and COLODOR (M-ERA.NET transnational Call 2015, funded by the Austrian Research Promotion Agency (FFG), no.854066, and the Bundesministerium für Bildung und Forschung, Germany).
Progress in integrated photonics enables development of integrated photonics circuits with new unique properties, circuits of the future, and overcomes current limits in information and communication technologies. The packaging of photonic integrated circuits is necessary for taking them out of research laboratories into real implementation in the information and communication technology applications.
Telecom optical fibers are still being the best transmission medium of digital data and analogue signals for long distance applications. The effective coupling of optical radiation between telecom optical fiber with ten microns core dimension and photonic integrated circuits optical waveguides with submicron dimensions are necessary. To address these challenges, we present our concept of photonics integrated circuit packaging with radio frequency, direct current and fiber array ports with automated active alignment system.
Optical splitters are passive optical components, which have found applications in a wide range of telecom, sensing, medical and many other scientific areas.
Low-index contrast optical splitters (Silica-on-Silicon (SoS) based waveguide devices) feature many advantages such as low fiber coupling losses and low propagation losses. They are considered an attractive DWDM solution in the telecommunication for all optical signal processing in optical communication systems. Nowadays the steadily increasing data volume in communication networks is driven by a rapid proliferation of home-based and business computers, storage capacities, processing capabilities and the extensive availability of Internet. The challenge is to transfer high data volumes in short periods of time over high distances as lossless as possible. The task of the optical splitters in Fiber-to-the-x (FTTx) network is to split one optical signal in many identical signals bringing for example the same TV signal in different households. Of course, the more buildings can be served by one optical splitter the lower are the installation costs.
High-index contrast optical splitters (such as silicon, silicon nitride or polymer based waveguide devices) feature much smaller waveguide size compared to low index contrast splitters. Such compact devices can easily be implemented on-chip and have already been used in the development of optical sensors, devices for DNA diagnostics and for infrared spectroscopy.
We will present the latest achievements in the design of two mostly used optical splitters (MMI and Y-branch) and discuss their advantages and disadvantages. Finally, some applications of the splitters developed in the frame of various projects will be presented.
This work was carried out in the framework of the project PHOCOP (no. SK-AT-2017-0013) and NAMOPRISIN (no. SK-AT-2017-0005) from the Slovak research and development agency of the Ministry of Education, Science, Research and Sport of the Slovak Republic and SK 16/2018 and 15/2018 from OeAD-GmbH.
We present the technological verification of a size-optimized 160-channel, 50-GHz silicon nitride-based AWG-spectrometer. The spectrometer was designed for TM-polarized light with a central wavelength of 850 nm applying our proprietary “AWG-Parameters” tool. For the simulations of AWG layout, the WDM PHASAR photonics tool from Optiwave was used. The simulated results show satisfying optical properties of the designed AWG-spectrometer. However, the high-channel count causes a large AWG size with standard design approaches. To solve this problem we designed a special taper enabling the reduction of AWG structure by about 15% while keeping the same optical properties. The AWG design was fabricated and the measured spectra not only confirm the proposed size-reduction but also the improvement of optical properties of the size-optimized AWG.
Compact and high-resolution 256-channel silicon nitride based AWG-spectrometer for OCT on a chip
(2019)
We present design, simulation and technological verification of a compact 256-channel, 42-GHz silicon nitride based AWG-spectrometer. The spectrometer was designed for TM-polarized light with a central wavelength of 850 nm, applying “AWG-Parameters” tool. This design is based on a previous study of various AWG designs (8-channel, 100-GHz; 20-channel, 50-GHz; 40-channel, 50-GHz, 80-channel, 50-GHz and 160-channel, 50-GHz AWGs), which were all technologically verified. The spectrometer features small size and high resolution. It is integrated on OCT chip using standard CMOS processes. The SD-OCT system is developed to operate in a wavelength range from 800 nm to 900 nm, having 0.1 nm resolution.
Introducing 3D sub-micrometer technologies based on polymers opened new possibilities of design and fabrication of photonic devices and components in 3D arrangement. 3D laser lithography is direct writing process based on two photon polymerization exhibiting high accuracy and versatility, where numerous resists and even polymer ceramic mixtures can be used. We present design and simulation of polymer based photonic components with a focus on arrayed waveguide gratings (AWG) based on optical multiplexers/demultiplexers and optical splitters. All optical components were designed for 1550 nm operating wavelength, applying two commercial photonics tools. This study creates a basis for the design of optical components in 3D arrangement, which will be fabricated by 3D laser lithography.
SiN is a suitable material for fabricating of photonic integrated circuits with middle refractive index contrast for the visible and near infrared spectral region with ultra-low propagation losses. The paper deals with the design and simulation of fiber to SiN chip butt coupler with single step fabrication process without thickness tapering. Coupler is designed for 850 nm band for coupling between strip 0.25 μm × 1.00 μm waveguide and Nufern's 780-OCT single mode optical fiber with core diameter 4.4 μm. The coupling losses simulation results of the two simulation methods finite-difference beam propagation techniques and eigenmode expansion method are compared.
