Refine
Document Type
- Article (7)
- Conference Proceeding (1)
Institute
Language
- English (8)
Is part of the Bibliography
- yes (8)
Keywords
- Laser ablation (3)
- Laser beam machining (2)
- Conduction bands (1)
- Cracking (1)
- Distributed feedback lasers (1)
- Dye lasers (1)
- Elemental semiconductors (1)
- Excimer lasers (1)
- Femtosecond ablation (1)
- Femtosecond laser (1)
We have demonstrated micromachining of bulk 3C silicon carbide (3C- SiC) wafers by employing 1028nm wavelength femtosecond laser pulses of energy less than 10 nJ directly from a femtosecond laser oscillator, thus eliminating the need for an amplified system and increasing the micromachining speed by more than four orders of magnitude.
We have investigated the ablation behaviour of single crystal SrTiO3 <100> with focus on the influence of the pulse duration at a wavelength of 248 nm. The experiments were performed with KrF-excimer lasers with pulse durations of 34 ns and 500 fs, respectively. Femtosecond-ablation turns out to be more efficient by one order of magnitude and to eliminate the known problem of cracking of SrTiO3 during laser machining with longer pulses. In addition, the cavities ablated with femtosecond pulses display a smoother surface with no indication of melting and well-defined, sharp edges. These effects can be explained by the reduced thermal shock effect on the material by using ultrashort pulses.
