Refine
Year of publication
- 2021 (19) (remove)
Document Type
- Article (11)
- Conference Proceeding (8)
Institute
- Forschungszentrum Mikrotechnik (19) (remove)
Language
- English (19)
Is part of the Bibliography
- yes (19)
Keywords
- MMI splitters (4)
- Y-branch splitter (4)
- Arrayed waveguide gratings (2)
- Laser ablation (2)
- Light propagation (2)
- Polymer (2)
- Telecommunications (2)
- #kinderuni4you (1)
- 1x128 MMI splitter (1)
- 3D MMI splitters (1)
In recent years, ultrashort pulsed lasers have increased their applicability for industrial requirements, as reliable femtosecond and picosecond laser sources with high output power are available on the market. Compared to conventional laser sources, high quality processing of a large number of material classes with different mechanical and optical properties is possible. In the field of laser cutting, these properties enable the cutting of multilayer substrates with changing material properties. In this work, the femtosecond laser cutting of phosphor sheets is demonstrated. The substrate contains a 230 micrometer thick silicone layer filled with phosphor, which is embedded between two glass plates. Due to the softness and thermal sensitivity of the silicone layer in combination with the hard and brittle dielectric material, the separation of such a material combination is challenging for both mechanical separation processes and cutting with conventional laser sources. In our work, we show that the femtosecond laser is suitable to cut the substrate with a high cutting edge quality. In addition to the experimental results of the laser dicing process, we present a universal model that allows predicting the final cutting edge geometry of a multilayer substrate.
Entangled photon generation at 1550 nm in the telecom C-band is of critical importance as it enables the realization of quantum communication protocols over long distance using deployed telecommunication infrastructure. InAs epitaxial quantum dots have recently enabled on-demand generation of entangled photons in this wavelength range. However, time-dependent state evolution, caused by the fine-structure splitting, currently limits the fidelity to a specific entangled state. Here, we show fine-structure suppression for InAs quantum dots using micromachined piezoelectric actuators and demonstrate generation of highly entangled photons at 1550 nm. At the lowest fine-structure setting, we obtain a maximum fidelity of 90.0 ± 2.7% (concurrence of 87.5 ± 3.1%). The concurrence remains high also for moderate (weak) temporal filtering, with values close to 80% (50%), corresponding to 30% (80%) of collected photons, respectively. The presented fine-structure control opens the way for exploiting entangled photons from quantum dots in fiber-based quantum communication protocols.
Arrayed Waveguide Grating (AWG) is a passive optical component, which have found applications in a wide range of photonic applications including telecommunications and medicine. Silica-on-Silicon (SoS) based AWGs use a low refractive-index contrast between the core (waveguide) and the cladding which leads to some significant advantages such as low propagation losses and low fiber coupling losses between the AWG waveguides and the fibres. Therefore, they are an attractive DWDM solution offering higher channel count technology and good performance characteristics compared to other methods. However, the very low refractive-index contrast means the bending radius of the waveguides needs to be very large (on the order of several millimeters) and may not fall below a particular critical value to suppress bending losses. As a result, silica-based waveguide devices usually have a very large size that limits the integration density of SiO2-based photonic integrated devices. High-index contrast AWGs (such as silicon, silicon nitride or polymer-based waveguide devices) feature much smaller waveguide size compared to low index contrast AWGs. Such compact devices can easily be implemented on a chip and have already found applications in emerging applications such as optical sensors, devices for DNA diagnostics and optical spectrometers for infrared spectroscopy.In this work, we present the design, simulation, technological verification and applications of both, the low-index contrast and high-index contrast AWGs. For telecommunication applications AWG-MUX/Demux with up to 128-channels will be presented. For medical applications the AWG-spectrometer with up to 512-channels will be presented.This work was carried out in the framework of the projects: ADOPT No. SK-AT-20-0012, NOVASiN No. SK-AT-20-0017 and AUTOPIC No. APVV-17-0662 from Slovak research and development agency of Ministry of Education, Science, Research and Sport of the Slovak Republic and No. SK 07/2021 and SK 08/2021 from Austrian Agency for International Cooperation in Education and Research (OeAD-GmbH); and project PASTEL, no. 2020-10-15-001, funded by SAIA.
A Telecom optical fibers are still being the best transmission medium of digital data and analogue signals for long distance applications. Progress in integrated photonics enables development of photonic chips with new unique properties, circuits of the future, and overcomes current limits in information and communication technologies. The packaging of photonic chips is necessary for taking them out of research laboratories into real implementation in the information and communication technology applications. One important step of packaging is effective coupling of optical radiation between telecom optical fiber with ten microns core dimension and photonic chip optical waveguide with submicron dimensions. For complex photonic chips, it is necessary to couple not one optical fiber but several optical fibers, which are arranged in fiber arrays. In this case, it is necessary to use a 6D positioning system, which allows to optimally adjust the relative position of the photonic chip and the fiber arrays. After setting the optimal relative position of the photonic chip and the fiber array, the process of their fixation follows. One possibility of fixation is gluing with an adhesive in the optical path between the photonic chip and an array of optical fibers with a refractive index close to the refractive index of the optical fiber core. This paper is focused on the experimental test set-up for the temperature characterization of fiber array to photonics chip butt coupling at 1310 nm and 1550 nm wavelengths fixed themselves by UV adhesive in the optical path. The main aims of this works are selection of better adhesive from two types for gluing of photonic chip and fiber array in packaging process of photonics chips and validation of gluing process developing. The coupling and alignment of fiber arrays to photonics chip were done by automated active alignments system and they were fixed themselves by curable epoxy adhesive. Temperature changes of coupling insertion losses are measured and investigated for two different UV adhesives during three temperature cycles from -40 °C to 80 °C in climatic chamber according to Telcordia. Spectral dependence of insertion losses were measured and compared before and after three temperature cycles for 1530 nm to 1570 nm spectral range at room temperature.
This work was supported by the Slovak Research and Development Agency under the contracts APVV-17-0662 and SK-AT-20-0017 and by the COST Action “European Network for High Performance Integrated Microwave Photonics” (EUIMWP) CA16220.
In this paper, design of 1×8 multimode interference passive optical splitter is proposed. The structure of the splitter is designed based on a silicon nitride material platform. This work aims to find the minimum physical dimensions of the designed splitters with the satisfactory optical performance. According to the minimum insertion loss and minimum non-uniformity, the optimum length of the splitters is determined.
Femtosecond laser ablation on Si generates 2D ripple structures, known as laser induced periodic surface structures (LIPSS) and pinholes. We fabricated membranes with 20 to 50 μm thickness perforated by an array of tapered pinholes up to 5 μm in diameter and 10 to 20 μm spacing. Within several micrometer the pinholes transform into hollow photonic waveguides with constant diameter from 1μm to 2μm. Such structures offer a 3D photonic coupling device for polymer Y-branch- and MMI-splitter. We measured a considerable change of electrical resistivity for 500 ppm H2 in air using Si/SiO2/TiO2 substrates with 2D LIPSS. We propose to investigate 3D waveguide arrays also for photonic-chemical sensors.
In this paper we report on the experimental test set-up for the temperature characterization of fiber array to photonics chip butt coupling at 1310 nm and 1550 nm wavelengths. The alignment and gluing of fiber arrays to photonics chip were done by automated active alignments system and they were fixed themselves by UV curable epoxy adhesive. Temperature changes of coupling insertion losses are measured and investigated for two different UV adhesives during three temperature cycles from -40 °C to 80 °C in climatic chamber. Spectral dependence of insertion losses was measured and compared before and after three temperature cycles for 1530 nm to 1570 nm spectral range at room temperature.
We present design, simulation and optimization of polymer based 16-channel, 100-GHz AWG designed for central wavelength of 1550 nm. The input design parameters were calculated applying AWG-Parameters tool. The simulations were performed applying a commercial photonic tool PHASAR from Optiwave. The achieved transmission characteristics were evaluated by AWG-Analyzer tool and show a satisfying agreement between designed and simulated AWG optical properties. Finally, the influence of the number of phased array (PA) waveguides on the AWG performance was studied. The results show that there is a certain minimum number of PA waveguides necessary to reach sufficient AWG performance.