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Coupling is one of the most frequently mentioned metric in software systems. However, to measure logical coupling between microservices, runtime information is needed or the availability of service-log files to analyze the calls between services is required. This work presents our emerging results, in which we propose a metric to statically calculate logical coupling between microservices based on commits to versioning systems. We performed an initial validation of the proposed metric with a dataset containing 145 open-source microservices projects. The results illustrate how logical coupling affects every system and increases overtime. However, we did not find a correlation between the number of commits or the number of developers and the introduction of logical coupling. In future, we investigate why, how, and when logical coupling is introduced in a system.
Leadership, leader-follower relationship, and
subordinates’ behaviors during the Covid-19
pandemic
(2021)
The present research had compared how Uppsala and Bartlett & Ghoshal (B&G) models explain the internationalization process of the Brazilian pulp producer Fibria.
The Uppsala model describes the developments of capabilities that enable the firm to move towards higher commitments abroad. Despite its sine-qua-non dependence on foreign markets, it is unlikely that Fibria will internationalize its production to another country, given the country-specific advantages that the company has in Brazil. Nevertheless, Fibria set its structure abroad even when the direct exports would suffice to reach the markets without any foreign direct investment.
B&G deals with the aspects of the organizational structure and described the Transnational type as the evolution of the international firm. In their typology, Fibria was a Global and Ethnocentric type, but interestingly, elements of Transnational and Geocentric models were also observed in the company.
Both theories overlap or complement each other in many aspects. However, they could not explain the peculiarities of the internationalization of Fibria. One reason is the lack of country-related elements in these models.
Eventually, comparisons between theories such as those presented enable decision-makers to align the corporate strategy using suitable models, bearing in mind the limitations that each method entails.
Modern portable electronic devices have seen component heat load increasing, while the space available for heat dissipation has decreased. This requires the thermal management system to be optimized to attain the high performance heat sink. Heat sinks plays a major role for dissipating heat in electronic devices. Phase change material (PCM) is used to enhance the heat dissipation in heat sink. This paper reports the results of an experimental investigation of the performance of Pin fin heat sinks filled with phase change materials for thermal management of electronic devices. The experimental set ups are prepared with the graphical programming language with Lab VIEW (Laboratory Virtual Instruments for Engineering Workbench. Three different types of Pin fin Heat sink with and without PCM are investigated based on different operational timings and the temperature is acquired with the help of Data Acquisition Card (DAQ). The results indicated that the inclusion of the PCM could stabilize the temperature for a longer period and reduce the heating rates and peak temperatures of heat sink with increasing the number of fins can enhance the thermal performance of electronic devices.