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Oral applications of ultra-short laser pulses - a new approach for gentle and painless treatment?
(2006)
We have demonstrated micromachining of bulk 3C silicon carbide (3C- SiC) wafers by employing 1028nm wavelength femtosecond laser pulses of energy less than 10 nJ directly from a femtosecond laser oscillator, thus eliminating the need for an amplified system and increasing the micromachining speed by more than four orders of magnitude.
We have investigated the ablation behaviour of single crystal SrTiO3 <100> with focus on the influence of the pulse duration at a wavelength of 248 nm. The experiments were performed with KrF-excimer lasers with pulse durations of 34 ns and 500 fs, respectively. Femtosecond-ablation turns out to be more efficient by one order of magnitude and to eliminate the known problem of cracking of SrTiO3 during laser machining with longer pulses. In addition, the cavities ablated with femtosecond pulses display a smoother surface with no indication of melting and well-defined, sharp edges. These effects can be explained by the reduced thermal shock effect on the material by using ultrashort pulses.
Design and simulation of 128-channel 10 GHz AWG for ultra-dense wavelength division multiplexing
(2012)
Silicon nanophotonics
(2013)
Compression of ultrashort laser pulses via gated multiphoton intrapulse interference phase scans
(2014)
Design of low loss 1x64 y-branch splitter having symmetric splitting ratio and small footprint
(2014)
Application of various tools to design, simulate and evaluate optical demultiplexers based on AWG
(2015)
Calculation of accurate channel spacing of an AWG optical demultiplexer applying proportional method
(2015)
Investigations of the damage mechanisms during ultrashort pulse laser ablation of dental tissue
(2015)
Investigation of optical thin films printed on the surface of facets of photonic crystal fibers
(2015)
Arrayed Waveguide Gratings
(2016)