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Optoelectronic system based on photonic integrated circuits to miniaturize spectral domain OCT
(2023)
We present a miniaturized optical coherence tomography (OCT) setup based on photonic integrated circuits (PIC) for the 850 nm range. We designed a 512-channel arrayed waveguide grating (AWG) on a PIC for spectral domain OCT (SD-OCT) that is co-integrated with PIN-photodiodes and analog-to-digital-converters on one single chip. This image sensor is combined with all the necessary electronics to act as a camera. It is integrated into a fiber-based OCT system, achieving a sensitivity of >80dB and various samples are imaged. This optoelectronic system will allow building small and cost-effective OCT systems to monitor retinal diseases.
The goal of this paper is to design a low-loss 1 x 32 Y-branch optical splitter for optical transmission systems, using two different design tools employing Beam Propagation Method. As a first step, a conventional 1 x 32 Y-branch splitter was designed and simulated in two-dimensional environment of OptiBPM photonic tool. The simulated optical properties feature high loss, high asymmetric splitting ratio and a large size of the designed structure, too. In the second step of this work we propose an optimization of the conventional splitter design leading to suppression of the asymmetric splitting ratio to one-third of its initial value and to the improvement of the losses by nearly 2 dB. In addition, 50% size reduction of the designed structure was also achieved. This length-optimized low-loss splitter was then modelled in a three-dimensional environment of RSoft photonic tool and the simulated results confirm the strong improvement of the optical properties.
Design of low loss 1x64 y-branch splitter having symmetric splitting ratio and small footprint
(2014)
Progress in integrated photonics enables development of integrated photonics circuits with new unique properties, circuits of the future, and overcomes current limits in information and communication technologies. The packaging of photonic integrated circuits is necessary for taking them out of research laboratories into real implementation in the information and communication technology applications.
Telecom optical fibers are still being the best transmission medium of digital data and analogue signals for long distance applications. The effective coupling of optical radiation between telecom optical fiber with ten microns core dimension and photonic integrated circuits optical waveguides with submicron dimensions are necessary. To address these challenges, we present our concept of photonics integrated circuit packaging with radio frequency, direct current and fiber array ports with automated active alignment system.
SiN is a suitable material for fabricating of photonic integrated circuits with middle refractive index contrast for the visible and near infrared spectral region with ultra-low propagation losses. The paper deals with the design and simulation of fiber to SiN chip butt coupler with single step fabrication process without thickness tapering. Coupler is designed for 850 nm band for coupling between strip 0.25 μm × 1.00 μm waveguide and Nufern's 780-OCT single mode optical fiber with core diameter 4.4 μm. The coupling losses simulation results of the two simulation methods finite-difference beam propagation techniques and eigenmode expansion method are compared.
A Telecom optical fibers are still being the best transmission medium of digital data and analogue signals for long distance applications. Progress in integrated photonics enables development of photonic chips with new unique properties, circuits of the future, and overcomes current limits in information and communication technologies. The packaging of photonic chips is necessary for taking them out of research laboratories into real implementation in the information and communication technology applications. One important step of packaging is effective coupling of optical radiation between telecom optical fiber with ten microns core dimension and photonic chip optical waveguide with submicron dimensions. For complex photonic chips, it is necessary to couple not one optical fiber but several optical fibers, which are arranged in fiber arrays. In this case, it is necessary to use a 6D positioning system, which allows to optimally adjust the relative position of the photonic chip and the fiber arrays. After setting the optimal relative position of the photonic chip and the fiber array, the process of their fixation follows. One possibility of fixation is gluing with an adhesive in the optical path between the photonic chip and an array of optical fibers with a refractive index close to the refractive index of the optical fiber core. This paper is focused on the experimental test set-up for the temperature characterization of fiber array to photonics chip butt coupling at 1310 nm and 1550 nm wavelengths fixed themselves by UV adhesive in the optical path. The main aims of this works are selection of better adhesive from two types for gluing of photonic chip and fiber array in packaging process of photonics chips and validation of gluing process developing. The coupling and alignment of fiber arrays to photonics chip were done by automated active alignments system and they were fixed themselves by curable epoxy adhesive. Temperature changes of coupling insertion losses are measured and investigated for two different UV adhesives during three temperature cycles from -40 °C to 80 °C in climatic chamber according to Telcordia. Spectral dependence of insertion losses were measured and compared before and after three temperature cycles for 1530 nm to 1570 nm spectral range at room temperature.
This work was supported by the Slovak Research and Development Agency under the contracts APVV-17-0662 and SK-AT-20-0017 and by the COST Action “European Network for High Performance Integrated Microwave Photonics” (EUIMWP) CA16220.
The main aims of this work are the validation of the developed process of gluing a single-mode optical fiber array with a photonic chip and the selection of a more suitable adhesive from the two adhesives being compared. An active alignment system was used for adjusting the two optical fiber arrays to a photonics chip. The gluing was done by two compared UV curable adhesives applied in the optical path. The insertion losses of glued coupling were measured and investigated at two discrete wavelengths 1310 nm and 1550 nm during temperature testing in the climatic chamber according to Telcordia GR_1209_Corei04 [3]. The measurement, investigation, and comparison of insertion losses of the glued coupling at the spectral band from 1530 nm to 1570 nm were done immediately after gluing process and after three temperature cycles in the climatic chamber with one month delay.
In this paper we report on the experimental test set-up for the temperature characterization of fiber array to photonics chip butt coupling at 1310 nm and 1550 nm wavelengths. The alignment and gluing of fiber arrays to photonics chip were done by automated active alignments system and they were fixed themselves by UV curable epoxy adhesive. Temperature changes of coupling insertion losses are measured and investigated for two different UV adhesives during three temperature cycles from -40 °C to 80 °C in climatic chamber. Spectral dependence of insertion losses was measured and compared before and after three temperature cycles for 1530 nm to 1570 nm spectral range at room temperature.
The paper deals with designing and numerical modelling a 2 x 2 optical switch for photonic integrated circuits based on 2 x 2 MMI elements and phase modulators. The 2 x 2 optical switch was modelled in the RsoftCAD with the simulation tool BeamPROP. The 2 x 2 optical switch is a common element for creating more complex 1 x N or N x N optical switches in all-optical signal processing.
The paper deals with the optimization of 2x2 optical switch for photonic integrated circuits based on two 2x2 MMI splitters and two phase-modulators. The optical switch was modelled in the RSoftCAD with the simulation tool BeamPROP. The optimization was done to minimise the insertion losses and broaden the spectral band at 1550 nm by using linear tapers in a 2x2 MMI splitter topology. The 2x2 optical switch is a common element for creating more complex 1xN or NxN optical switches in all-optical signal processing.
We present design and simulation of 16-channel, 100-GHz silicon nitride based AWG using BeamPROP simulation engine of RSoft photonic tool. The AWG was designed for TM-polarized light with central wavelength of 850 nm. The input design parameters were calculated applying AWG-Parameters tool. For this purpose, we created a ridge waveguide structure, used in the design of the AWG layout, and performed FEM simulation. The output of the BPM simulation of AWG structure are the transmission characteristics, which was used to calculate transmission parameters defining optical properties of simulated AWG. The achieved simulation results are in a good agreement with the design.
We present a new concept of 3D polymer-based 1 × 4 beam splitter for wavelength splitting around 1550 nm. The beam splitter consists of IP-Dip polymer as a core and polydimethylsiloxane (PDMS) Sylgard 184 as a cladding. The splitter was designed and simulated with two different photonics tools and the results show high splitting ratio for single-mode and multi-mode operation with low losses. Based on the simulations, a 3D beam splitter was designed and realized using direct laser writing (DLW) process with adaptation to coupling to standard single-mode fiber. With respect to the technological limits, the multi-mode splitter having core of (4 × 4) μm 2 was designed and fabricated together with supporting stable mechanical construction. Splitting properties were investigated by intensity monitoring of splitter outputs using optical microscopy and near-field scanning optical microscopy. In the development phase, the optical performance of fabricated beam splitter was examined by splitting of short visible wavelengths using red light emitting diode. Finally, the splitting of 1550 nm laser light was studied in detail by near-field measurements and compared with the simulated results. The nearly single-mode operation was observed and the shape of propagating mode and mode field diameter was well recognized.
The photonic integrated circuits are required in the next generations of coherent terabit optical communications. The software tools for automated adjustment and coupling of optical fiber arrays to photonic integrated circuits has been developed. The obtained results are needed in final production phase in the technology process of photonic integrated circuits packaging.
This study presents different approaches to increase the sensing area of NiO based semiconducting metal oxide gas sensors. Micro- and nanopatterned laser induced periodic surface structures (LIPSS) are generated on silicon and Si/SiO2 substrates. The surface morphologies of the fabricated samples are examined by FE SEM. We select the silicon samples with an intermediate Si3N4 layer due to its superior isolation quality over the thermal oxide for evaluating the hydrogen and acetone sensitivity of a NiO based test sensor.
A new software tool, called AWG-Channel-Spacing, is developed to calculate accurate channel spacing of an arrayed waveguide gratings (AWG) optical multiplexer/demultiplexer. This tool has been developed with the application framework QT in the programming language C++. The tool was evaluated with a design of 20-channel 200 GHz AWG. The achieved simulated transmission characteristics prove the correct functionality of the tool.
A new software tool, called AWG-Wuckler, is developed to calculate geometric parameters of arrayed waveguide grating structures for telecommunication and medical applications. These parameters are crucial for a AWG layout which will be created and simulated using commercial photonic design tools. The design process of AWG is very complex because its geometric dimensions depend on a large number of input design parameters and other input design parameters. Often geometric constraints require an adjustment of the input design parameters and vice versa. Calculation and adjustment of the geometric parameters is a time-consuming process that is currently not fully supported by any commercial photonic tool. AWG-Wuckler tool overcomes this issue and offers a fast and easy to use solution. The tool was already applied in various AWG designs and is technologically well proven.
Investigation of optical thin films printed on the surface of facets of photonic crystal fibers
(2015)
Due to the increasing trend of photonic element miniaturisation and the need for optical splitting, we propose and simulate a new type of three-dimensional (3D) optical splitter based on multimode interference (MMI) for the wavelength of 1550 nm. We present various designs and simulations of various parameters for the optimized MMI splitter. We focus on the possibility of its integration on an optical fiber. The design is focused on a possible production process using 3D laser lithography for the prepared experiments. The MMI splitter was prepared by laser lithography using direct writing process and finally investigated by output characterisation by the near-field measurement.
In this paper, we propose and simulate a new type of three-dimensional (3D) optical splitter based on multimode interference (MMI) for the wavelength of 1550 nm. The splitter was proposed on the square basis with the width of 20 x 20 µm2 using the IP-Dip polymer as a standard material for 3D laser lithography. We present the optical field distribution in the proposed MMI splitter and its integration possibility on optical fiber. The design is aimed to the possible fabrication process using the 3D laser lithography for forthcoming experiments.
In this paper, we document optical splitters based on Y-branch and also on MMI splitting principle. The 1×4 Y-branch splitter was prepared in 3D geometry fully from polymer approaching the single mode transmission at 1550 nm. We also prepared new concept of 1×4 MMI optical splitter. Their optical properties and character of output optical field were measured by near-field scanning optical microscope. Splitting properties and optical outputs of both splitters are very promising and increase an attractiveness of presented 3D technology and polymers.
The paper shows concepts of optical splitting based on three dimensional (3D) optical splitters based on multimode interference principle. This paper is focused on the design, fabrication and characterization of 3D MMI splitter with formed output waveguides based on IP-Dip polymer for direct application on optical fiber. The MMI optical splitter was simulated and fabricated using direct laser writing process. Output characteristics were characterized by highly resolved near-field scanning optical microscope (NSOM) and compared with 3D MMI splitter without output waveguides.
In this work, we present a significant step toward in vivo ophthalmic optical coherence tomography and angiography on a photonic integrated chip. The diffraction gratings used in spectral-domain optical coherence tomography can be replaced by photonic integrated circuits comprising an arrayed waveguide grating. Two arrayed waveguide grating designs with 256 channels were tested, which enabled the first chip-based optical coherence tomography and angiography in vivo three-dimensional human retinal measurements. Design 1 supports a bandwidth of 22 nm, with which a sensitivity of up to 91 dB (830 µW) and an axial resolution of 10.7 µm was measured. Design 2 supports a bandwidth of 48 nm, with which a sensitivity of 90 dB (480 µW) and an axial resolution of 6.5 µm was measured. The silicon nitride-based integrated optical waveguides were fabricated with a fully CMOS-compatible process, which allows their monolithic co-integration on top of an optoelectronic silicon chip. As a benchmark for chip-based optical coherence tomography, tomograms generated by a commercially available clinical spectral-domain optical coherence tomography system were compared to those acquired with on-chip gratings. The similarities in the tomograms demonstrate the significant clinical potential for further integration of optical coherence tomography on a chip system.
Abstract: ams AG is a leading provider of sensing solutions developing semiconductor sensors in a wide variety of fields, with optical sensing as one of the key competences. Since integrated photonics is a promising technology for new sensor systems, ams AG has been developing processes for fully integrated CMOS-compatible photonic components based on Si3N4. This talk will provide an overview on the processing of basic photonic building blocks and their optical properties and performance. We will also give examples for applications in the fields of optical coherence tomography and opto-chemical gas sensing. In the 1980s photonics started its way for common use in telecommunication technology, using optical fiber technologies. In recent years, also a variety of photonic sensors has been proposed and developed. One of the major drawbacks of most of these photonic devices has been the lack of integration into existing (semiconductor) production processes, so far. This integration is feasible using SiN material systems to process monolithically integrated CMOS-compatible photonic sensors in the visible and near-infrared spectrum. We will present the basic processing steps for the SiN photonic technology, the development of some critical processing steps such as SiN deposition and SiN etching as well as several photonic components (waveguides, splitters, etc.) with their optical properties. One of the applications presented relates to optical coherence tomography (OCT), a fast growing imaging technique in ophthalmology. Drawbacks of existing OCT systems are their high costs as well as their bulkiness, which prevents a wider spread use of OCT systems.
One way to overcome both cost and size issues is to integrate optical and electrical components on a single chip.
Part of this work was carried out in the framework of the projects COHESION (funded by the Austrian Research Promotion Agency (FFG), no. 848588), OCTCHIP (funded by the EU’ Horizon 2020 research and innovation programme, no. 688173), and COLODOR (M-ERA.NET transnational Call 2015, funded by the Austrian Research Promotion Agency (FFG), no.854066, and the Bundesministerium für Bildung und Forschung, Germany).
Design, simulation, and optimization of the 1×4 optical three-dimensional multimode interference splitter using IP-Dip polymer as a core and polydimethylsiloxane (PDMS) Sylgard 184 as a cladding is demonstrated. The splitter was simulated by using beam propagation method in BeamPROP simulation module of RSoft photonic tool and optimized for an operating wavelength of 1.55 μm . According to the minimum insertion loss, the dimensions of the splitter were optimized for a waveguide with a core size of 4×4 μm2 . The objective of the study is to create the design for fabrication by three-dimensional direct laser writing optical lithography.
In this paper, the design of three-dimensional configuration of Y-branch splitter is compared with Multimode Interference splitter. Both splitters use the IP-Dip polymer as a standard material for 3D laser lithography. The optical properties of the splitters for both approaches are discussed and compared.
This paper presents design, simulation, and optimization of the three-dimensional 1×4 optical multimode interference splitter using IP-Dip polymer as a core and polydimethylsiloxane (PDMS) Sylgard 184 as a cladding. The splitter was simulated by using beam propagation method in BeamPROP simulation engine of RSoft photonic tool and optimized for an operating wavelength of 1.55 µm. According to the minimum insertion loss, the dimensions of the MMI coupler and the length of the whole MMI splitter structure were optimized applying a waveguide with a core size of 4×4 µm2. The objective of the study is to create a design for fabrication by three-dimensional direct laser writing optical lithography.
Design, simulation, and optimization of the 1×4 optical three-dimensional multimode interference splitter using IP-Dip polymer as a core and polydimethylsiloxane (PDMS) Sylgard 184 as a cladding is demonstrated. The splitter was simulated by using beam propagation method in BeamPROP simulation module of RSoft photonic tool and optimized for an operating wavelength of 1.55 μm . According to the minimum insertion loss, the dimensions of the splitter were optimized for a waveguide with a core size of 4×4 μm2 . The objective of the study is to create the design for fabrication by three-dimensional direct laser writing optical lithography.