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Design, simulation, and optimization of the 1×4 optical three-dimensional multimode interference splitter using IP-Dip polymer as a core and polydimethylsiloxane (PDMS) Sylgard 184 as a cladding is demonstrated. The splitter was simulated by using beam propagation method in BeamPROP simulation module of RSoft photonic tool and optimized for an operating wavelength of 1.55 μm . According to the minimum insertion loss, the dimensions of the splitter were optimized for a waveguide with a core size of 4×4 μm2 . The objective of the study is to create the design for fabrication by three-dimensional direct laser writing optical lithography.
In this paper we present various educational activities with Photonics Explorer, an educational kit developed by the photonics research team B - PHOT at VUB (Vrije Universiteit Brussel) for students at secondary schools. The concept is a ‘lab-in-a-box’ that enables students of the 2 nd and 3 rd grade to do photonics experiments themselves at school with lasers, LEDs, lenses, optical fibers, and other high-tech components. Even though, the kit was developed for the secondary schools, we use experiments from the kit also for some other teaching activities such as lectures at the university, photonics workshops for teachers and children at primary/secondary schools or for events such as children's/youth's university or the night of sciences. In the frame of Austrian based project Phorsch! we have organized most of these activities which will be presented here.
A new software tool, called AWG-Channel-Spacing, is developed to calculate accurate channel spacing of an arrayed waveguide gratings (AWG) optical multiplexer/demultiplexer. This tool has been developed with the application framework QT in the programming language C++. The tool was evaluated with a design of 20-channel 200 GHz AWG. The achieved simulated transmission characteristics prove the correct functionality of the tool.
A new software tool, called AWG-Wuckler, is developed to calculate geometric parameters of arrayed waveguide grating structures for telecommunication and medical applications. These parameters are crucial for a AWG layout which will be created and simulated using commercial photonic design tools. The design process of AWG is very complex because its geometric dimensions depend on a large number of input design parameters and other input design parameters. Often geometric constraints require an adjustment of the input design parameters and vice versa. Calculation and adjustment of the geometric parameters is a time-consuming process that is currently not fully supported by any commercial photonic tool. AWG-Wuckler tool overcomes this issue and offers a fast and easy to use solution. The tool was already applied in various AWG designs and is technologically well proven.
This paper aims to study the design, simulation, and optimization of low-loss Y-branch passive optical splitters up to 64 output ports for telecommunication applications. For a waveguide channel profile, the standard material silica-on-silicon is used. The Y-splitters are designed and simulated at telecommunication operating wavelength, λ = 1550 nm. Except for the lengths of the used Y-branches, and a core size of the waveguides, design parameters such as port pitch between the waveguides and simulation parameters for all splitters are considered fixed. The simulation results are analyzed to determine the optimum length of the splitters and the optimum core size. Based on this optimization the total length of the highest designed 1×64 Y-branch splitter was reduced by 41.14 % for a waveguide core (5×5) μm2 compared to the length of splitter with a standard (6×6) μm2 core size.
In recent years, ultrashort pulsed lasers have increased their applicability for industrial requirements, as reliable femtosecond and picosecond laser sources with high output power are available on the market. Compared to conventional laser sources, high quality processing of a large number of material classes with different mechanical and optical properties is possible. In the field of laser cutting, these properties enable the cutting of multilayer substrates with changing material properties. In this work, the femtosecond laser cutting of phosphor sheets is demonstrated. The substrate contains a 230 micrometer thick silicone layer filled with phosphor, which is embedded between two glass plates. Due to the softness and thermal sensitivity of the silicone layer in combination with the hard and brittle dielectric material, the separation of such a material combination is challenging for both mechanical separation processes and cutting with conventional laser sources. In our work, we show that the femtosecond laser is suitable to cut the substrate with a high cutting edge quality. In addition to the experimental results of the laser dicing process, we present a universal model that allows predicting the final cutting edge geometry of a multilayer substrate.
Entangled photon generation at 1550 nm in the telecom C-band is of critical importance as it enables the realization of quantum communication protocols over long distance using deployed telecommunication infrastructure. InAs epitaxial quantum dots have recently enabled on-demand generation of entangled photons in this wavelength range. However, time-dependent state evolution, caused by the fine-structure splitting, currently limits the fidelity to a specific entangled state. Here, we show fine-structure suppression for InAs quantum dots using micromachined piezoelectric actuators and demonstrate generation of highly entangled photons at 1550 nm. At the lowest fine-structure setting, we obtain a maximum fidelity of 90.0 ± 2.7% (concurrence of 87.5 ± 3.1%). The concurrence remains high also for moderate (weak) temporal filtering, with values close to 80% (50%), corresponding to 30% (80%) of collected photons, respectively. The presented fine-structure control opens the way for exploiting entangled photons from quantum dots in fiber-based quantum communication protocols.
Arrayed Waveguide Grating (AWG) is a passive optical component, which have found applications in a wide range of photonic applications including telecommunications and medicine. Silica-on-Silicon (SoS) based AWGs use a low refractive-index contrast between the core (waveguide) and the cladding which leads to some significant advantages such as low propagation losses and low fiber coupling losses between the AWG waveguides and the fibres. Therefore, they are an attractive DWDM solution offering higher channel count technology and good performance characteristics compared to other methods. However, the very low refractive-index contrast means the bending radius of the waveguides needs to be very large (on the order of several millimeters) and may not fall below a particular critical value to suppress bending losses. As a result, silica-based waveguide devices usually have a very large size that limits the integration density of SiO2-based photonic integrated devices. High-index contrast AWGs (such as silicon, silicon nitride or polymer-based waveguide devices) feature much smaller waveguide size compared to low index contrast AWGs. Such compact devices can easily be implemented on a chip and have already found applications in emerging applications such as optical sensors, devices for DNA diagnostics and optical spectrometers for infrared spectroscopy.In this work, we present the design, simulation, technological verification and applications of both, the low-index contrast and high-index contrast AWGs. For telecommunication applications AWG-MUX/Demux with up to 128-channels will be presented. For medical applications the AWG-spectrometer with up to 512-channels will be presented.This work was carried out in the framework of the projects: ADOPT No. SK-AT-20-0012, NOVASiN No. SK-AT-20-0017 and AUTOPIC No. APVV-17-0662 from Slovak research and development agency of Ministry of Education, Science, Research and Sport of the Slovak Republic and No. SK 07/2021 and SK 08/2021 from Austrian Agency for International Cooperation in Education and Research (OeAD-GmbH); and project PASTEL, no. 2020-10-15-001, funded by SAIA.
A Telecom optical fibers are still being the best transmission medium of digital data and analogue signals for long distance applications. Progress in integrated photonics enables development of photonic chips with new unique properties, circuits of the future, and overcomes current limits in information and communication technologies. The packaging of photonic chips is necessary for taking them out of research laboratories into real implementation in the information and communication technology applications. One important step of packaging is effective coupling of optical radiation between telecom optical fiber with ten microns core dimension and photonic chip optical waveguide with submicron dimensions. For complex photonic chips, it is necessary to couple not one optical fiber but several optical fibers, which are arranged in fiber arrays. In this case, it is necessary to use a 6D positioning system, which allows to optimally adjust the relative position of the photonic chip and the fiber arrays. After setting the optimal relative position of the photonic chip and the fiber array, the process of their fixation follows. One possibility of fixation is gluing with an adhesive in the optical path between the photonic chip and an array of optical fibers with a refractive index close to the refractive index of the optical fiber core. This paper is focused on the experimental test set-up for the temperature characterization of fiber array to photonics chip butt coupling at 1310 nm and 1550 nm wavelengths fixed themselves by UV adhesive in the optical path. The main aims of this works are selection of better adhesive from two types for gluing of photonic chip and fiber array in packaging process of photonics chips and validation of gluing process developing. The coupling and alignment of fiber arrays to photonics chip were done by automated active alignments system and they were fixed themselves by curable epoxy adhesive. Temperature changes of coupling insertion losses are measured and investigated for two different UV adhesives during three temperature cycles from -40 °C to 80 °C in climatic chamber according to Telcordia. Spectral dependence of insertion losses were measured and compared before and after three temperature cycles for 1530 nm to 1570 nm spectral range at room temperature.
This work was supported by the Slovak Research and Development Agency under the contracts APVV-17-0662 and SK-AT-20-0017 and by the COST Action “European Network for High Performance Integrated Microwave Photonics” (EUIMWP) CA16220.
In this paper, design of 1×8 multimode interference passive optical splitter is proposed. The structure of the splitter is designed based on a silicon nitride material platform. This work aims to find the minimum physical dimensions of the designed splitters with the satisfactory optical performance. According to the minimum insertion loss and minimum non-uniformity, the optimum length of the splitters is determined.
Femtosecond laser ablation on Si generates 2D ripple structures, known as laser induced periodic surface structures (LIPSS) and pinholes. We fabricated membranes with 20 to 50 μm thickness perforated by an array of tapered pinholes up to 5 μm in diameter and 10 to 20 μm spacing. Within several micrometer the pinholes transform into hollow photonic waveguides with constant diameter from 1μm to 2μm. Such structures offer a 3D photonic coupling device for polymer Y-branch- and MMI-splitter. We measured a considerable change of electrical resistivity for 500 ppm H2 in air using Si/SiO2/TiO2 substrates with 2D LIPSS. We propose to investigate 3D waveguide arrays also for photonic-chemical sensors.
In this paper we report on the experimental test set-up for the temperature characterization of fiber array to photonics chip butt coupling at 1310 nm and 1550 nm wavelengths. The alignment and gluing of fiber arrays to photonics chip were done by automated active alignments system and they were fixed themselves by UV curable epoxy adhesive. Temperature changes of coupling insertion losses are measured and investigated for two different UV adhesives during three temperature cycles from -40 °C to 80 °C in climatic chamber. Spectral dependence of insertion losses was measured and compared before and after three temperature cycles for 1530 nm to 1570 nm spectral range at room temperature.
We present design, simulation and optimization of polymer based 16-channel, 100-GHz AWG designed for central wavelength of 1550 nm. The input design parameters were calculated applying AWG-Parameters tool. The simulations were performed applying a commercial photonic tool PHASAR from Optiwave. The achieved transmission characteristics were evaluated by AWG-Analyzer tool and show a satisfying agreement between designed and simulated AWG optical properties. Finally, the influence of the number of phased array (PA) waveguides on the AWG performance was studied. The results show that there is a certain minimum number of PA waveguides necessary to reach sufficient AWG performance.
This paper presents the design, simulation, and optimization of a 1×128 multimode interference (MMI) splitter with a silica-on-silicon channel profile. This work aims to study the influence of the different S-Bend output waveguide shapes at the end of the MMI coupler on the final optical properties. The 1×128 MMI splitters have been simulated using beam propagation method in OptiBPM software. The optical properties of all considered splitters with different shapes of outputs waveguides are discussed and compared with each other. Based on the minimum insertion loss and non-uniformity, the final shape of output waveguides, ensuring the lowest losses, is determined.