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Silicon nanophotonics
(2013)
Design of low loss 1x64 y-branch splitter having symmetric splitting ratio and small footprint
(2014)
Progress in integrated photonics enables development of integrated photonics circuits with new unique properties, circuits of the future, and overcomes current limits in information and communication technologies. The packaging of photonic integrated circuits is necessary for taking them out of research laboratories into real implementation in the information and communication technology applications.
Telecom optical fibers are still being the best transmission medium of digital data and analogue signals for long distance applications. The effective coupling of optical radiation between telecom optical fiber with ten microns core dimension and photonic integrated circuits optical waveguides with submicron dimensions are necessary. To address these challenges, we present our concept of photonics integrated circuit packaging with radio frequency, direct current and fiber array ports with automated active alignment system.
SiN is a suitable material for fabricating of photonic integrated circuits with middle refractive index contrast for the visible and near infrared spectral region with ultra-low propagation losses. The paper deals with the design and simulation of fiber to SiN chip butt coupler with single step fabrication process without thickness tapering. Coupler is designed for 850 nm band for coupling between strip 0.25 μm × 1.00 μm waveguide and Nufern's 780-OCT single mode optical fiber with core diameter 4.4 μm. The coupling losses simulation results of the two simulation methods finite-difference beam propagation techniques and eigenmode expansion method are compared.
Comparison of silicon nitride based 1x8 Y-branch splitters applying different waveguide structures
(2019)
This paper presents design, simulation and optimization of 1x8 Y-branch power splitters based on Si/SiO2/SiN/SiOx material platform. For the designs, two different waveguide structures were used, i.e. ridge and rib waveguides. The splitters were designed for 850 nm spectral optical window and the simulations were performed applying FEM and BPM methods in RSoft photonic tool. The aim of this work was to find minimum physical dimensions of the designed splitters occupying minimal space on PIC chip. The optimization was done with regards to high symmetrical splitting ratio and low insertion loss. Finally, the optical properties of both splitters were studied and compared with each other.
Comparison of silicon nitride based 8-channel 100-GHz AWGs applying different waveguide structures
(2019)
This paper presents design and simulation of 8-channel, 100-GHz AWGs based on Si/SiO2/SiN/SiOx material platform. For the designs, two different waveguide structures were used, i.e. ridge and rib waveguides. AWGs were designed for central wavelength of 850 nm applying AWG-Parameters tool. The simulations were performed applying FEM and BPM methods in RSoft and PHASAR photonic tools. The simulation results show considerably lower losses but slightly higher channel crosstalk when applying rib waveguides.
We present design and simulation of 16-channel, 100-GHz silicon nitride based AWG using BeamPROP simulation engine of RSoft photonic tool. The AWG was designed for TM-polarized light with central wavelength of 850 nm. The input design parameters were calculated applying AWG-Parameters tool. For this purpose, we created a ridge waveguide structure, used in the design of the AWG layout, and performed FEM simulation. The output of the BPM simulation of AWG structure are the transmission characteristics, which was used to calculate transmission parameters defining optical properties of simulated AWG. The achieved simulation results are in a good agreement with the design.
The photonic integrated circuits are required in the next generations of coherent terabit optical communications. The software tools for automated adjustment and coupling of optical fiber arrays to photonic integrated circuits has been developed. The obtained results are needed in final production phase in the technology process of photonic integrated circuits packaging.
A Telecom optical fibers are still being the best transmission medium of digital data and analogue signals for long distance applications. Progress in integrated photonics enables development of photonic chips with new unique properties, circuits of the future, and overcomes current limits in information and communication technologies. The packaging of photonic chips is necessary for taking them out of research laboratories into real implementation in the information and communication technology applications. One important step of packaging is effective coupling of optical radiation between telecom optical fiber with ten microns core dimension and photonic chip optical waveguide with submicron dimensions. For complex photonic chips, it is necessary to couple not one optical fiber but several optical fibers, which are arranged in fiber arrays. In this case, it is necessary to use a 6D positioning system, which allows to optimally adjust the relative position of the photonic chip and the fiber arrays. After setting the optimal relative position of the photonic chip and the fiber array, the process of their fixation follows. One possibility of fixation is gluing with an adhesive in the optical path between the photonic chip and an array of optical fibers with a refractive index close to the refractive index of the optical fiber core. This paper is focused on the experimental test set-up for the temperature characterization of fiber array to photonics chip butt coupling at 1310 nm and 1550 nm wavelengths fixed themselves by UV adhesive in the optical path. The main aims of this works are selection of better adhesive from two types for gluing of photonic chip and fiber array in packaging process of photonics chips and validation of gluing process developing. The coupling and alignment of fiber arrays to photonics chip were done by automated active alignments system and they were fixed themselves by curable epoxy adhesive. Temperature changes of coupling insertion losses are measured and investigated for two different UV adhesives during three temperature cycles from -40 °C to 80 °C in climatic chamber according to Telcordia. Spectral dependence of insertion losses were measured and compared before and after three temperature cycles for 1530 nm to 1570 nm spectral range at room temperature.
This work was supported by the Slovak Research and Development Agency under the contracts APVV-17-0662 and SK-AT-20-0017 and by the COST Action “European Network for High Performance Integrated Microwave Photonics” (EUIMWP) CA16220.