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In this paper, low-loss Y-branch splitters up to 128 splitting ratio are designed, simulated, and optimized by using 2D beam propagation method in OptiBPM tool by Optiwave. For an optical waveguide, a silica-on-silicon material platform is used. The splitters were designed as a planar structure for a telecommunication operating wavelength of 1.55 m. According to the minimum insertion loss and minimum non-uniformity, the optimum length for each Y-branch is determined. The influence of the pre-defined S-Bend waveguide shapes (Arc, Cosine, Sine) and of the waveguide core size reduction on the splitter performance has been also studied. The obtained simulation results of all designed splitters with different S-Bend shape waveguides together with the different waveguide core sizes are discussed and compared with each other.
A Telecom optical fibers are still being the best transmission medium of digital data and analogue signals for long distance applications. Progress in integrated photonics enables development of photonic chips with new unique properties, circuits of the future, and overcomes current limits in information and communication technologies. The packaging of photonic chips is necessary for taking them out of research laboratories into real implementation in the information and communication technology applications. One important step of packaging is effective coupling of optical radiation between telecom optical fiber with ten microns core dimension and photonic chip optical waveguide with submicron dimensions. For complex photonic chips, it is necessary to couple not one optical fiber but several optical fibers, which are arranged in fiber arrays. In this case, it is necessary to use a 6D positioning system, which allows to optimally adjust the relative position of the photonic chip and the fiber arrays. After setting the optimal relative position of the photonic chip and the fiber array, the process of their fixation follows. One possibility of fixation is gluing with an adhesive in the optical path between the photonic chip and an array of optical fibers with a refractive index close to the refractive index of the optical fiber core. This paper is focused on the experimental test set-up for the temperature characterization of fiber array to photonics chip butt coupling at 1310 nm and 1550 nm wavelengths fixed themselves by UV adhesive in the optical path. The main aims of this works are selection of better adhesive from two types for gluing of photonic chip and fiber array in packaging process of photonics chips and validation of gluing process developing. The coupling and alignment of fiber arrays to photonics chip were done by automated active alignments system and they were fixed themselves by curable epoxy adhesive. Temperature changes of coupling insertion losses are measured and investigated for two different UV adhesives during three temperature cycles from -40 °C to 80 °C in climatic chamber according to Telcordia. Spectral dependence of insertion losses were measured and compared before and after three temperature cycles for 1530 nm to 1570 nm spectral range at room temperature.
This work was supported by the Slovak Research and Development Agency under the contracts APVV-17-0662 and SK-AT-20-0017 and by the COST Action “European Network for High Performance Integrated Microwave Photonics” (EUIMWP) CA16220.
The main aims of this work are the validation of the developed process of gluing a single-mode optical fiber array with a photonic chip and the selection of a more suitable adhesive from the two adhesives being compared. An active alignment system was used for adjusting the two optical fiber arrays to a photonics chip. The gluing was done by two compared UV curable adhesives applied in the optical path. The insertion losses of glued coupling were measured and investigated at two discrete wavelengths 1310 nm and 1550 nm during temperature testing in the climatic chamber according to Telcordia GR_1209_Corei04 [3]. The measurement, investigation, and comparison of insertion losses of the glued coupling at the spectral band from 1530 nm to 1570 nm were done immediately after gluing process and after three temperature cycles in the climatic chamber with one month delay.
In this paper we report on the experimental test set-up for the temperature characterization of fiber array to photonics chip butt coupling at 1310 nm and 1550 nm wavelengths. The alignment and gluing of fiber arrays to photonics chip were done by automated active alignments system and they were fixed themselves by UV curable epoxy adhesive. Temperature changes of coupling insertion losses are measured and investigated for two different UV adhesives during three temperature cycles from -40 °C to 80 °C in climatic chamber. Spectral dependence of insertion losses was measured and compared before and after three temperature cycles for 1530 nm to 1570 nm spectral range at room temperature.
This study presents different approaches to increase the sensing area of NiO based semiconducting metal oxide gas sensors. Micro- and nanopatterned laser induced periodic surface structures (LIPSS) are generated on silicon and Si/SiO2 substrates. The surface morphologies of the fabricated samples are examined by FE SEM. We select the silicon samples with an intermediate Si3N4 layer due to its superior isolation quality over the thermal oxide for evaluating the hydrogen and acetone sensitivity of a NiO based test sensor.
This paper presents design, simulation, and optimization of the three-dimensional 1×4 optical multimode interference splitter using IP-Dip polymer as a core and polydimethylsiloxane (PDMS) Sylgard 184 as a cladding. The splitter was simulated by using beam propagation method in BeamPROP simulation engine of RSoft photonic tool and optimized for an operating wavelength of 1.55 µm. According to the minimum insertion loss, the dimensions of the MMI coupler and the length of the whole MMI splitter structure were optimized applying a waveguide with a core size of 4×4 µm2. The objective of the study is to create a design for fabrication by three-dimensional direct laser writing optical lithography.
The paper deals with the optimization of 2x2 optical switch for photonic integrated circuits based on two 2x2 MMI splitters and two phase-modulators. The optical switch was modelled in the RSoftCAD with the simulation tool BeamPROP. The optimization was done to minimise the insertion losses and broaden the spectral band at 1550 nm by using linear tapers in a 2x2 MMI splitter topology. The 2x2 optical switch is a common element for creating more complex 1xN or NxN optical switches in all-optical signal processing.
In this work, we investigated the influence of different etch depths of the rib waveguides on the performance of SiN-based AWGs. For this purpose, an 8-channel 100 GHz AWG was designed for a center wavelength of 850 nm. The design parameters entered were calculated using the AWG-Parameters tool. The simulations were performed with a commercial photonic tool PHASAR from Optiwave. The simulated performance was evaluated using the AWG-Analyzer tool. For the AWG design, we used three identical rib waveguides with different etch depths to simulate possible etch imperfection. The simulations show the wavelength shift and degradation of the AWG performance.
This paper presents the design, simulation, and optimization of a 1×128 multimode interference (MMI) splitter with a silica-on-silicon channel profile. This work aims to study the influence of the different S-Bend output waveguide shapes at the end of the MMI coupler on the final optical properties. The 1×128 MMI splitters have been simulated using beam propagation method in OptiBPM software. The optical properties of all considered splitters with different shapes of outputs waveguides are discussed and compared with each other. Based on the minimum insertion loss and non-uniformity, the final shape of output waveguides, ensuring the lowest losses, is determined.
Femtosecond laser ablation on Si generates 2D ripple structures, known as laser induced periodic surface structures (LIPSS) and pinholes. We fabricated membranes with 20 to 50 μm thickness perforated by an array of tapered pinholes up to 5 μm in diameter and 10 to 20 μm spacing. Within several micrometer the pinholes transform into hollow photonic waveguides with constant diameter from 1μm to 2μm. Such structures offer a 3D photonic coupling device for polymer Y-branch- and MMI-splitter. We measured a considerable change of electrical resistivity for 500 ppm H2 in air using Si/SiO2/TiO2 substrates with 2D LIPSS. We propose to investigate 3D waveguide arrays also for photonic-chemical sensors.
We present 256-channel, 25-GHz AWG designed for ultra-dense wavelength division multiplexing. For the design two in-house developed tools were used: AWG-Parameters tool for the calculation of input design parameters and AWGAnalyser tool, used to evaluate the simulated transmission characteristics. The AWG structure was designed for AWG central wavelength of 1550 nm and simulated with PHASAR tool from Optiwave. To keep the size of AWG structure as small as possible the number of waveguides in the phased array was tested. The simulations show that there is a certain minimum number of phased array waveguides necessary to reach sufficient AWG performance. After optimization, the AWG structure reached 10 cm x 11 cm in size and satisfying optical properties.
In this paper, design of 1×8 multimode interference passive optical splitter is proposed. The structure of the splitter is designed based on a silicon nitride material platform. This work aims to find the minimum physical dimensions of the designed splitters with the satisfactory optical performance. According to the minimum insertion loss and minimum non-uniformity, the optimum length of the splitters is determined.
We present design, simulation and optimization of polymer based 16-channel, 100-GHz AWG designed for central wavelength of 1550 nm. The input design parameters were calculated applying AWG-Parameters tool. The simulations were performed applying a commercial photonic tool PHASAR from Optiwave. The achieved transmission characteristics were evaluated by AWG-Analyzer tool and show a satisfying agreement between designed and simulated AWG optical properties. Finally, the influence of the number of phased array (PA) waveguides on the AWG performance was studied. The results show that there is a certain minimum number of PA waveguides necessary to reach sufficient AWG performance.
We present design of planar 16-channel, 100-GHz multi-mode polymer-based AWG. This AWG was designed for central wavelength of 1550 nm applying AWG-Parameters tool. The AWG structure was created and simulated in the commercial photonic tool PHASAR from Optiwave. Achieved transmission characteristics were evaluated by AWG-Analyzer tool. For the design, multi-mode waveguides having a cross-section of (4x4) µm2 were used. The simulated results show strong worsening of the transmission characteristics in comparison when using single-mode waveguides. Nevertheless, the transmitting channels are clearly separated. The reason for using thicker multi-mode waveguides in the design is possibility to fabricate the AWG structure on polymer basis using direct laser writing lithography.
Design, simulation, and optimization of the 1×4 optical three-dimensional multimode interference splitter using IP-Dip polymer as a core and polydimethylsiloxane (PDMS) Sylgard 184 as a cladding is demonstrated. The splitter was simulated by using beam propagation method in BeamPROP simulation module of RSoft photonic tool and optimized for an operating wavelength of 1.55 μm . According to the minimum insertion loss, the dimensions of the splitter were optimized for a waveguide with a core size of 4×4 μm2 . The objective of the study is to create the design for fabrication by three-dimensional direct laser writing optical lithography.
Design, simulation, and optimization of the 1×4 optical three-dimensional multimode interference splitter using IP-Dip polymer as a core and polydimethylsiloxane (PDMS) Sylgard 184 as a cladding is demonstrated. The splitter was simulated by using beam propagation method in BeamPROP simulation module of RSoft photonic tool and optimized for an operating wavelength of 1.55 μm . According to the minimum insertion loss, the dimensions of the splitter were optimized for a waveguide with a core size of 4×4 μm2 . The objective of the study is to create the design for fabrication by three-dimensional direct laser writing optical lithography.
This paper aims to study the design, simulation, and optimization of low-loss Y-branch passive optical splitters up to 64 output ports for telecommunication applications. For a waveguide channel profile, the standard material silica-on-silicon is used. The Y-splitters are designed and simulated at telecommunication operating wavelength, λ = 1550 nm. Except for the lengths of the used Y-branches, and a core size of the waveguides, design parameters such as port pitch between the waveguides and simulation parameters for all splitters are considered fixed. The simulation results are analyzed to determine the optimum length of the splitters and the optimum core size. Based on this optimization the total length of the highest designed 1×64 Y-branch splitter was reduced by 41.14 % for a waveguide core (5×5) μm2 compared to the length of splitter with a standard (6×6) μm2 core size.
Design and optimization of 1x2N Y-branch optical splitters for telecommunication applications
(2020)
This paper presents the design and optimization of 1x2N Y-branch optical splitters for telecom applications. A waveguide channel profile, used in the splitter design, is based on a standard silica-on-silicon material platform. Except for the lengths of the used Y-branches, design parameters such as port pitch between the waveguides and simulation parameters for all splitters were considered fixed. For every Y-branch splitter, insertion loss, non-uniformity, and background crosstalk are calculated. According to the minimum insertion loss and minimum non-uniformity, the optimum length for each Y-branch is determined. Finally, the individual Y-branches are cascade joined to design various Y-branch optical splitters, from 1x2 to 1x64.