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A Telecom optical fibers are still being the best transmission medium of digital data and analogue signals for long distance applications. Progress in integrated photonics enables development of photonic chips with new unique properties, circuits of the future, and overcomes current limits in information and communication technologies. The packaging of photonic chips is necessary for taking them out of research laboratories into real implementation in the information and communication technology applications. One important step of packaging is effective coupling of optical radiation between telecom optical fiber with ten microns core dimension and photonic chip optical waveguide with submicron dimensions. For complex photonic chips, it is necessary to couple not one optical fiber but several optical fibers, which are arranged in fiber arrays. In this case, it is necessary to use a 6D positioning system, which allows to optimally adjust the relative position of the photonic chip and the fiber arrays. After setting the optimal relative position of the photonic chip and the fiber array, the process of their fixation follows. One possibility of fixation is gluing with an adhesive in the optical path between the photonic chip and an array of optical fibers with a refractive index close to the refractive index of the optical fiber core. This paper is focused on the experimental test set-up for the temperature characterization of fiber array to photonics chip butt coupling at 1310 nm and 1550 nm wavelengths fixed themselves by UV adhesive in the optical path. The main aims of this works are selection of better adhesive from two types for gluing of photonic chip and fiber array in packaging process of photonics chips and validation of gluing process developing. The coupling and alignment of fiber arrays to photonics chip were done by automated active alignments system and they were fixed themselves by curable epoxy adhesive. Temperature changes of coupling insertion losses are measured and investigated for two different UV adhesives during three temperature cycles from -40 °C to 80 °C in climatic chamber according to Telcordia. Spectral dependence of insertion losses were measured and compared before and after three temperature cycles for 1530 nm to 1570 nm spectral range at room temperature.
This work was supported by the Slovak Research and Development Agency under the contracts APVV-17-0662 and SK-AT-20-0017 and by the COST Action “European Network for High Performance Integrated Microwave Photonics” (EUIMWP) CA16220.
Arrayed Waveguide Grating (AWG) is a passive optical component, which have found applications in a wide range of photonic applications including telecommunications and medicine. Silica-on-Silicon (SoS) based AWGs use a low refractive-index contrast between the core (waveguide) and the cladding which leads to some significant advantages such as low propagation losses and low fiber coupling losses between the AWG waveguides and the fibres. Therefore, they are an attractive DWDM solution offering higher channel count technology and good performance characteristics compared to other methods. However, the very low refractive-index contrast means the bending radius of the waveguides needs to be very large (on the order of several millimeters) and may not fall below a particular critical value to suppress bending losses. As a result, silica-based waveguide devices usually have a very large size that limits the integration density of SiO2-based photonic integrated devices. High-index contrast AWGs (such as silicon, silicon nitride or polymer-based waveguide devices) feature much smaller waveguide size compared to low index contrast AWGs. Such compact devices can easily be implemented on a chip and have already found applications in emerging applications such as optical sensors, devices for DNA diagnostics and optical spectrometers for infrared spectroscopy.In this work, we present the design, simulation, technological verification and applications of both, the low-index contrast and high-index contrast AWGs. For telecommunication applications AWG-MUX/Demux with up to 128-channels will be presented. For medical applications the AWG-spectrometer with up to 512-channels will be presented.This work was carried out in the framework of the projects: ADOPT No. SK-AT-20-0012, NOVASiN No. SK-AT-20-0017 and AUTOPIC No. APVV-17-0662 from Slovak research and development agency of Ministry of Education, Science, Research and Sport of the Slovak Republic and No. SK 07/2021 and SK 08/2021 from Austrian Agency for International Cooperation in Education and Research (OeAD-GmbH); and project PASTEL, no. 2020-10-15-001, funded by SAIA.
This paper presents design, simulation, and optimization of the three-dimensional 1×4 optical multimode interference splitter using IP-Dip polymer as a core and polydimethylsiloxane (PDMS) Sylgard 184 as a cladding. The splitter was simulated by using beam propagation method in BeamPROP simulation engine of RSoft photonic tool and optimized for an operating wavelength of 1.55 µm. According to the minimum insertion loss, the dimensions of the MMI coupler and the length of the whole MMI splitter structure were optimized applying a waveguide with a core size of 4×4 µm2. The objective of the study is to create a design for fabrication by three-dimensional direct laser writing optical lithography.
We present design of planar 16-channel, 100-GHz multi-mode polymer-based AWG. This AWG was designed for central wavelength of 1550 nm applying AWG-Parameters tool. The AWG structure was created and simulated in the commercial photonic tool PHASAR from Optiwave. Achieved transmission characteristics were evaluated by AWG-Analyzer tool. For the design, multi-mode waveguides having a cross-section of (4x4) µm2 were used. The simulated results show strong worsening of the transmission characteristics in comparison when using single-mode waveguides. Nevertheless, the transmitting channels are clearly separated. The reason for using thicker multi-mode waveguides in the design is possibility to fabricate the AWG structure on polymer basis using direct laser writing lithography.
In this paper, the design of three-dimensional configuration of Y-branch splitter is compared with Multimode Interference splitter. Both splitters use the IP-Dip polymer as a standard material for 3D laser lithography. The optical properties of the splitters for both approaches are discussed and compared.
The paper deals with designing and numerical modelling a 2 x 2 optical switch for photonic integrated circuits based on 2 x 2 MMI elements and phase modulators. The 2 x 2 optical switch was modelled in the RsoftCAD with the simulation tool BeamPROP. The 2 x 2 optical switch is a common element for creating more complex 1 x N or N x N optical switches in all-optical signal processing.