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A Telecom optical fibers are still being the best transmission medium of digital data and analogue signals for long distance applications. Progress in integrated photonics enables development of photonic chips with new unique properties, circuits of the future, and overcomes current limits in information and communication technologies. The packaging of photonic chips is necessary for taking them out of research laboratories into real implementation in the information and communication technology applications. One important step of packaging is effective coupling of optical radiation between telecom optical fiber with ten microns core dimension and photonic chip optical waveguide with submicron dimensions. For complex photonic chips, it is necessary to couple not one optical fiber but several optical fibers, which are arranged in fiber arrays. In this case, it is necessary to use a 6D positioning system, which allows to optimally adjust the relative position of the photonic chip and the fiber arrays. After setting the optimal relative position of the photonic chip and the fiber array, the process of their fixation follows. One possibility of fixation is gluing with an adhesive in the optical path between the photonic chip and an array of optical fibers with a refractive index close to the refractive index of the optical fiber core. This paper is focused on the experimental test set-up for the temperature characterization of fiber array to photonics chip butt coupling at 1310 nm and 1550 nm wavelengths fixed themselves by UV adhesive in the optical path. The main aims of this works are selection of better adhesive from two types for gluing of photonic chip and fiber array in packaging process of photonics chips and validation of gluing process developing. The coupling and alignment of fiber arrays to photonics chip were done by automated active alignments system and they were fixed themselves by curable epoxy adhesive. Temperature changes of coupling insertion losses are measured and investigated for two different UV adhesives during three temperature cycles from -40 °C to 80 °C in climatic chamber according to Telcordia. Spectral dependence of insertion losses were measured and compared before and after three temperature cycles for 1530 nm to 1570 nm spectral range at room temperature.
This work was supported by the Slovak Research and Development Agency under the contracts APVV-17-0662 and SK-AT-20-0017 and by the COST Action “European Network for High Performance Integrated Microwave Photonics” (EUIMWP) CA16220.
In this paper we report on the experimental test set-up for the temperature characterization of fiber array to photonics chip butt coupling at 1310 nm and 1550 nm wavelengths. The alignment and gluing of fiber arrays to photonics chip were done by automated active alignments system and they were fixed themselves by UV curable epoxy adhesive. Temperature changes of coupling insertion losses are measured and investigated for two different UV adhesives during three temperature cycles from -40 °C to 80 °C in climatic chamber. Spectral dependence of insertion losses was measured and compared before and after three temperature cycles for 1530 nm to 1570 nm spectral range at room temperature.
Der erste Band der ogsa-Reihe greift aktuelle Themen der Sozialen Arbeit in der Postmigrationsgesellschaft auf. Dazu werden mit Migration verbundene Phänomene in ihren theoretischen Grundannahmen, institutionellen Strukturen und in Praxisfeldern reflektiert sowie kritische Perspektiven auf einen professionellen Umgang damit entwickelt. In Tandems aus Theorie und Praxis werden jeweils Themen wie Differenz und Macht, Rassismus, Postkolonialität, Intersektionalität, Empowerment, Social Justice, Border Struggles, Critical Citizenship u. v. m. diskutiert.
Rückblicke zur 5. ogsaTAGUNG
(2021)
To create a map of an unknown area, autonomous robots must follow a strategy to explore the area without knowing the optimal paths to reduce the time needed to map the whole area. To reduce the time to accomplish this task, multiple robots can work together to create a map in a more efficient way. However, without proper coordination, the time a team of autonomous robots needs to explore the unknown area can exceed the time needed by a single robot. To counteract the challenges, a shared infrastructure is needed which extracts useful information for the individual robots out of the shared information of all robots so the exploration can be coordinated. These measures introduce new challenges to the system, concerning the load of the communication infrastructure as well as the overall task of exploring and mapping becoming dependent on the correct communication and robustness of the shared team infrastructure. Therefore, the amount of communication and dependency of each individual robot of the rest of the other robots of the team must be reduced to ensure that the robots can continue working even if the communication with the shared infrastructure fails.