Forschungszentrum Mikrotechnik
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- arrayed waveguide gratings (9)
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Design of low loss 1x64 y-branch splitter having symmetric splitting ratio and small footprint
(2014)
Progress in integrated photonics enables development of integrated photonics circuits with new unique properties, circuits of the future, and overcomes current limits in information and communication technologies. The packaging of photonic integrated circuits is necessary for taking them out of research laboratories into real implementation in the information and communication technology applications.
Telecom optical fibers are still being the best transmission medium of digital data and analogue signals for long distance applications. The effective coupling of optical radiation between telecom optical fiber with ten microns core dimension and photonic integrated circuits optical waveguides with submicron dimensions are necessary. To address these challenges, we present our concept of photonics integrated circuit packaging with radio frequency, direct current and fiber array ports with automated active alignment system.
SiN is a suitable material for fabricating of photonic integrated circuits with middle refractive index contrast for the visible and near infrared spectral region with ultra-low propagation losses. The paper deals with the design and simulation of fiber to SiN chip butt coupler with single step fabrication process without thickness tapering. Coupler is designed for 850 nm band for coupling between strip 0.25 μm × 1.00 μm waveguide and Nufern's 780-OCT single mode optical fiber with core diameter 4.4 μm. The coupling losses simulation results of the two simulation methods finite-difference beam propagation techniques and eigenmode expansion method are compared.
The main aims of this work are the validation of the developed process of gluing a single-mode optical fiber array with a photonic chip and the selection of a more suitable adhesive from the two adhesives being compared. An active alignment system was used for adjusting the two optical fiber arrays to a photonics chip. The gluing was done by two compared UV curable adhesives applied in the optical path. The insertion losses of glued coupling were measured and investigated at two discrete wavelengths 1310 nm and 1550 nm during temperature testing in the climatic chamber according to Telcordia GR_1209_Corei04 [3]. The measurement, investigation, and comparison of insertion losses of the glued coupling at the spectral band from 1530 nm to 1570 nm were done immediately after gluing process and after three temperature cycles in the climatic chamber with one month delay.
In this paper we report on the experimental test set-up for the temperature characterization of fiber array to photonics chip butt coupling at 1310 nm and 1550 nm wavelengths. The alignment and gluing of fiber arrays to photonics chip were done by automated active alignments system and they were fixed themselves by UV curable epoxy adhesive. Temperature changes of coupling insertion losses are measured and investigated for two different UV adhesives during three temperature cycles from -40 °C to 80 °C in climatic chamber. Spectral dependence of insertion losses was measured and compared before and after three temperature cycles for 1530 nm to 1570 nm spectral range at room temperature.
The paper deals with the optimization of 2x2 optical switch for photonic integrated circuits based on two 2x2 MMI splitters and two phase-modulators. The optical switch was modelled in the RSoftCAD with the simulation tool BeamPROP. The optimization was done to minimise the insertion losses and broaden the spectral band at 1550 nm by using linear tapers in a 2x2 MMI splitter topology. The 2x2 optical switch is a common element for creating more complex 1xN or NxN optical switches in all-optical signal processing.
Investigations of the damage mechanisms during ultrashort pulse laser ablation of dental tissue
(2015)
We present design and simulation of 16-channel, 100-GHz silicon nitride based AWG using BeamPROP simulation engine of RSoft photonic tool. The AWG was designed for TM-polarized light with central wavelength of 850 nm. The input design parameters were calculated applying AWG-Parameters tool. For this purpose, we created a ridge waveguide structure, used in the design of the AWG layout, and performed FEM simulation. The output of the BPM simulation of AWG structure are the transmission characteristics, which was used to calculate transmission parameters defining optical properties of simulated AWG. The achieved simulation results are in a good agreement with the design.
The photonic integrated circuits are required in the next generations of coherent terabit optical communications. The software tools for automated adjustment and coupling of optical fiber arrays to photonic integrated circuits has been developed. The obtained results are needed in final production phase in the technology process of photonic integrated circuits packaging.
A new software tool, called AWG-Channel-Spacing, is developed to calculate accurate channel spacing of an arrayed waveguide gratings (AWG) optical multiplexer/demultiplexer. This tool has been developed with the application framework QT in the programming language C++. The tool was evaluated with a design of 20-channel 200 GHz AWG. The achieved simulated transmission characteristics prove the correct functionality of the tool.
Deep etched structures in GaAs with high aspect ratio have promising applications in optoelectronics and MEMS devices. The key factors in their fabrication process are the choosing of proper mask material and etching conditions which results in high selectivity and an anisotropic etch profile with smooth sidewalls. In this work, we studied several types of mask materials (Al, Ni, Cr, SiO2) for deep reactive ion etching of GaAs using inductively coupled plasma system. Thus, several sets of experiments were performed with varying gas mixture, pressure and ICP/RF power. As a result, we find optimized conditions and minimal thickness of mask material for achieving deep etched (>140 m) GaAs structures.
A new software tool, called AWG-Wuckler, is developed to calculate geometric parameters of arrayed waveguide grating structures for telecommunication and medical applications. These parameters are crucial for a AWG layout which will be created and simulated using commercial photonic design tools. The design process of AWG is very complex because its geometric dimensions depend on a large number of input design parameters and other input design parameters. Often geometric constraints require an adjustment of the input design parameters and vice versa. Calculation and adjustment of the geometric parameters is a time-consuming process that is currently not fully supported by any commercial photonic tool. AWG-Wuckler tool overcomes this issue and offers a fast and easy to use solution. The tool was already applied in various AWG designs and is technologically well proven.
Various carbon (nano-) forms, so-called allotropes, have become one of the most supporting activities in fundamental and applied research trends. Therefore, a universal deposition process capable of “adjusting” system parameters in one “deposition chamber” is highly demanding. Here, we present a low-pressure large area deposition system combining radiofrequency (RF) and microwave (MW) plasma in one chamber in different configurations, which offers a wide deposition window for the growth of sp2 carbon (carbon nanotubes, amorphous carbon), a mixture of sp2 and sp3 (diamond-like films) and pure sp3 carbon represented by diamond films. We will show that not only the type of plasma source (RF vs. MW) but also the gas mixture and plasma chemistry are crucial parameters for the controllable and reproducible growth of these allotropes at temperatures from 250 to 800 °C.
Here we present the highly sensitive detection of dopamine using gold nanogap IDAs with redox-cycling amplification. Through the combination with a facile electrochemical activation and a chronoamperometric multistep protocol fouling of the gold electrode surface can be prevented and a sensitivity of 14 nA μM -1 with excellent linearity up to 10 μM is achieved. The low-cost and reproducible wafer level fabrication process of the nanogap IDAs plays a key role. Electrode and substrate materials can be nearly arbitrarily chosen. Also the gap sizes could be adjusted down to sub-100 nm dimensions with this versatile approach, allowing for very high signal amplification. In comparison to the current gold standard, fastscan cyclic voltammetry (FSCV) with carbon fiber microelectrodes (CFMEs), which suffers from high background currents, no elaborate data processing and high-end electronic equipment is needed. Employing our flexible, easy and inexpensive method, DA monitoring with a short acquisition period and a detection limit less than 200 nM is successfully demonstrated.