Forschungszentrum Mikrotechnik
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The photonic integrated circuits are required in the next generations of coherent terabit optical communications. The software tools for automated adjustment and coupling of optical fiber arrays to photonic integrated circuits has been developed. The obtained results are needed in final production phase in the technology process of photonic integrated circuits packaging.
We report resent results on the fabrication and characterization of carbon nanogap interdigitated electrode arrays (IDAs) for biosensor applications based on redox cycling. The electrochemical results of the carbon electrodes are compared to our fabricated gold electrodes with similar nanogap distances. The amplification factor and the collection efficiency were recorded by chronoamperometry. Cyclic voltammetry (CV) was utilized to determine the oxidation and reduction potentials as well as for monitoring the electron transfer process. The different deposited carbon materials were characterized by Raman spectroscopy.At present, we successfully fabricated carbon nanogaps down to 80 nm and we are convinced to reach the present fabrication limit of about 30 nm (for gold and platinum electrodes) with carbon as electrode material as well. To the best of our knowledge, this is the first IDA nanogap sensor, which features a gap distance under 100 nm with amorphous carbon as electrode material. Moreover, we present a signal amplification of 32 for carbon electrodes by redox cycling, which is the highest reported amplification so far.
In this study, we carried out the structural and thermal characterization of a medical-grade poly (lactide) (PLA) by SEC, TGA, DSC, NMR, ICP-MS and Py-GC/MS. Moreover, we investigated the laser-induced degradation occurring when ultrashort laser pulses (ULP) were employed to cut extremely thin polymer films prepared by solvent-casting. ULP polymer cutting technology is an interesting manufacturing process for its advantages in potential medical applications. In fact, heat transmission to the region surrounding the cuts is limited, so that the incisions are precise and the effects on the regions around them are small. In this way, the need for post-processing is reduced and ULP cutting becomes interesting for industrial applications. However, degradation induced by ULP may occur and compromise the properties of the polymer samples. To investigate this possibility, portions of PLA films, ultrashort laser cut (ULC) and uncut, were analysed by SEC, DSC, NMR and FTIR. Furthermore, PLA oligomers were studied by ESI-MS. Both SEC and NMR showed a decrease in the molecular weight. FTIR, ESI-MS and NMR spectra revealed the presence of olefin end groups originated from a \beta-H transfer mechanism, induced by heat and/or light (Norrish II mechanism). Additionally, the inspection of the ESI mass spectra highlighted the cleavage of ester bonds related to the Norrish I type mechanism, undetected by the other techniques.
Compact and high-resolution 256-channel silicon nitride based AWG-spectrometer for OCT on a chip
(2019)
We present design, simulation and technological verification of a compact 256-channel, 42-GHz silicon nitride based AWG-spectrometer. The spectrometer was designed for TM-polarized light with a central wavelength of 850 nm, applying “AWG-Parameters” tool. This design is based on a previous study of various AWG designs (8-channel, 100-GHz; 20-channel, 50-GHz; 40-channel, 50-GHz, 80-channel, 50-GHz and 160-channel, 50-GHz AWGs), which were all technologically verified. The spectrometer features small size and high resolution. It is integrated on OCT chip using standard CMOS processes. The SD-OCT system is developed to operate in a wavelength range from 800 nm to 900 nm, having 0.1 nm resolution.
Comparison of silicon nitride based 1x8 Y-branch splitters applying different waveguide structures
(2019)
This paper presents design, simulation and optimization of 1x8 Y-branch power splitters based on Si/SiO2/SiN/SiOx material platform. For the designs, two different waveguide structures were used, i.e. ridge and rib waveguides. The splitters were designed for 850 nm spectral optical window and the simulations were performed applying FEM and BPM methods in RSoft photonic tool. The aim of this work was to find minimum physical dimensions of the designed splitters occupying minimal space on PIC chip. The optimization was done with regards to high symmetrical splitting ratio and low insertion loss. Finally, the optical properties of both splitters were studied and compared with each other.
Comparison of silicon nitride based 8-channel 100-GHz AWGs applying different waveguide structures
(2019)
This paper presents design and simulation of 8-channel, 100-GHz AWGs based on Si/SiO2/SiN/SiOx material platform. For the designs, two different waveguide structures were used, i.e. ridge and rib waveguides. AWGs were designed for central wavelength of 850 nm applying AWG-Parameters tool. The simulations were performed applying FEM and BPM methods in RSoft and PHASAR photonic tools. The simulation results show considerably lower losses but slightly higher channel crosstalk when applying rib waveguides.
Progress in integrated photonics enables development of integrated photonics circuits with new unique properties, circuits of the future, and overcomes current limits in information and communication technologies. The packaging of photonic integrated circuits is necessary for taking them out of research laboratories into real implementation in the information and communication technology applications.
Telecom optical fibers are still being the best transmission medium of digital data and analogue signals for long distance applications. The effective coupling of optical radiation between telecom optical fiber with ten microns core dimension and photonic integrated circuits optical waveguides with submicron dimensions are necessary. To address these challenges, we present our concept of photonics integrated circuit packaging with radio frequency, direct current and fiber array ports with automated active alignment system.