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Micromachining of silicon carbide using femtosecond lasers
- We have demonstrated micromachining of bulk 3C silicon carbide (3C- SiC) wafers by employing 1028nm wavelength femtosecond laser pulses of energy less than 10 nJ directly from a femtosecond laser oscillator, thus eliminating the need for an amplified system and increasing the micromachining speed by more than four orders of magnitude.
| Author: | Maria Farsari, George Filippidis, Sandra Zoppel, Georg A. Reider, Costas Fotakis |
|---|---|
| DOI: | https://doi.org/10.1088/1742-6596/59/1/018 |
| Parent Title (English): | Journal of Physics: Conference Series |
| Document Type: | Article |
| Language: | English |
| Year of publication: | 2007 |
| Release Date: | 2020/12/22 |
| Volume: | o.Jg. |
| Issue: | Bd. 59: Eighth International Conference on Laser Ablation. Banff, Canada. 11–16 September 2005 |
| Article Number: | 018 |
| First Page: | 84 |
| Last Page: | 87 |
| Organisationseinheit: | Forschung / Forschungszentrum Mikrotechnik |
| DDC classes: | 500 Naturwissenschaften und Mathematik / 530 Physik |
| Open Access?: | ja |
| Peer review: | wiss. Beitrag, peer-reviewed |
| Publicationlist: | Stroj, Sandra |
| Licence (German): |  Creative Commons - CC BY - NC - SA - 4.0 International - Attribution - NonCommercial –ShareAlike - Namensnennung - Nicht kommerziell - Weitergabe unter gleichen Bedingungen |
