Forschungszentrum Mikrotechnik
Refine
Year of publication
Document Type
- Conference Proceeding (116)
- Article (84)
- Part of a Book (3)
- Doctoral Thesis (2)
- Book (1)
- Habilitation (1)
- Other (1)
Institute
- Forschungszentrum Mikrotechnik (208)
- Department of Engineering (Ende 2021 aufgelöst; Integration in die übergeordnete OE Technik) (2)
- Forschungszentrum Energie (2)
- Department of Computer Science (Ende 2021 aufgelöst; Integration in die übergeordnete OE Technik) (1)
- Forschungszentrum Nutzerzentrierte Technologien (1)
Language
- English (202)
- German (5)
- Multiple languages (1)
Keywords
- Laser ablation (11)
- Y-branch splitter (10)
- arrayed waveguide gratings (6)
- integrated optics (6)
- Arrayed waveguide gratings (5)
- OCT (5)
- insertion loss (5)
- MMI splitters (4)
- Optical coherence tomography (4)
- Couplers (3)
We present a new concept of 3D polymer-based 1 × 4 beam splitter for wavelength splitting around 1550 nm. The beam splitter consists of IP-Dip polymer as a core and polydimethylsiloxane (PDMS) Sylgard 184 as a cladding. The splitter was designed and simulated with two different photonics tools and the results show high splitting ratio for single-mode and multi-mode operation with low losses. Based on the simulations, a 3D beam splitter was designed and realized using direct laser writing (DLW) process with adaptation to coupling to standard single-mode fiber. With respect to the technological limits, the multi-mode splitter having core of (4 × 4) μm 2 was designed and fabricated together with supporting stable mechanical construction. Splitting properties were investigated by intensity monitoring of splitter outputs using optical microscopy and near-field scanning optical microscopy. In the development phase, the optical performance of fabricated beam splitter was examined by splitting of short visible wavelengths using red light emitting diode. Finally, the splitting of 1550 nm laser light was studied in detail by near-field measurements and compared with the simulated results. The nearly single-mode operation was observed and the shape of propagating mode and mode field diameter was well recognized.
We present design, simulation and optimization of polymer based 16-channel, 100-GHz AWG designed for central wavelength of 1550 nm. The input design parameters were calculated applying AWG-Parameters tool. The simulations were performed applying a commercial photonic tool PHASAR from Optiwave. The achieved transmission characteristics were evaluated by AWG-Analyzer tool and show a satisfying agreement between designed and simulated AWG optical properties. Finally, the influence of the number of phased array (PA) waveguides on the AWG performance was studied. The results show that there is a certain minimum number of PA waveguides necessary to reach sufficient AWG performance.
In this paper, design of 1×8 multimode interference passive optical splitter is proposed. The structure of the splitter is designed based on a silicon nitride material platform. This work aims to find the minimum physical dimensions of the designed splitters with the satisfactory optical performance. According to the minimum insertion loss and minimum non-uniformity, the optimum length of the splitters is determined.
In this paper, low-loss Y-branch splitters up to 128 splitting ratio are designed, simulated, and optimized by using 2D beam propagation method in OptiBPM tool by Optiwave. For an optical waveguide, a silica-on-silicon material platform is used. The splitters were designed as a planar structure for a telecommunication operating wavelength of 1.55 m. According to the minimum insertion loss and minimum non-uniformity, the optimum length for each Y-branch is determined. The influence of the pre-defined S-Bend waveguide shapes (Arc, Cosine, Sine) and of the waveguide core size reduction on the splitter performance has been also studied. The obtained simulation results of all designed splitters with different S-Bend shape waveguides together with the different waveguide core sizes are discussed and compared with each other.
In this paper, we propose and simulate a new type of three-dimensional (3D) optical splitter based on multimode interference (MMI) for the wavelength of 1550 nm. The splitter was proposed on the square basis with the width of 20 x 20 µm2 using the IP-Dip polymer as a standard material for 3D laser lithography. We present the optical field distribution in the proposed MMI splitter and its integration possibility on optical fiber. The design is aimed to the possible fabrication process using the 3D laser lithography for forthcoming experiments.
In recent years, ultrashort pulsed lasers have increased their applicability for industrial requirements, as reliable femtosecond and picosecond laser sources with high output power are available on the market. Compared to conventional laser sources, high quality processing of a large number of material classes with different mechanical and optical properties is possible. In the field of laser cutting, these properties enable the cutting of multilayer substrates with changing material properties. In this work, the femtosecond laser cutting of phosphor sheets is demonstrated. The substrate contains a 230 micrometer thick silicone layer filled with phosphor, which is embedded between two glass plates. Due to the softness and thermal sensitivity of the silicone layer in combination with the hard and brittle dielectric material, the separation of such a material combination is challenging for both mechanical separation processes and cutting with conventional laser sources. In our work, we show that the femtosecond laser is suitable to cut the substrate with a high cutting edge quality. In addition to the experimental results of the laser dicing process, we present a universal model that allows predicting the final cutting edge geometry of a multilayer substrate.
Entangled photon generation at 1550 nm in the telecom C-band is of critical importance as it enables the realization of quantum communication protocols over long distance using deployed telecommunication infrastructure. InAs epitaxial quantum dots have recently enabled on-demand generation of entangled photons in this wavelength range. However, time-dependent state evolution, caused by the fine-structure splitting, currently limits the fidelity to a specific entangled state. Here, we show fine-structure suppression for InAs quantum dots using micromachined piezoelectric actuators and demonstrate generation of highly entangled photons at 1550 nm. At the lowest fine-structure setting, we obtain a maximum fidelity of 90.0 ± 2.7% (concurrence of 87.5 ± 3.1%). The concurrence remains high also for moderate (weak) temporal filtering, with values close to 80% (50%), corresponding to 30% (80%) of collected photons, respectively. The presented fine-structure control opens the way for exploiting entangled photons from quantum dots in fiber-based quantum communication protocols.
Arrayed Waveguide Grating (AWG) is a passive optical component, which have found applications in a wide range of photonic applications including telecommunications and medicine. Silica-on-Silicon (SoS) based AWGs use a low refractive-index contrast between the core (waveguide) and the cladding which leads to some significant advantages such as low propagation losses and low fiber coupling losses between the AWG waveguides and the fibres. Therefore, they are an attractive DWDM solution offering higher channel count technology and good performance characteristics compared to other methods. However, the very low refractive-index contrast means the bending radius of the waveguides needs to be very large (on the order of several millimeters) and may not fall below a particular critical value to suppress bending losses. As a result, silica-based waveguide devices usually have a very large size that limits the integration density of SiO2-based photonic integrated devices. High-index contrast AWGs (such as silicon, silicon nitride or polymer-based waveguide devices) feature much smaller waveguide size compared to low index contrast AWGs. Such compact devices can easily be implemented on a chip and have already found applications in emerging applications such as optical sensors, devices for DNA diagnostics and optical spectrometers for infrared spectroscopy.In this work, we present the design, simulation, technological verification and applications of both, the low-index contrast and high-index contrast AWGs. For telecommunication applications AWG-MUX/Demux with up to 128-channels will be presented. For medical applications the AWG-spectrometer with up to 512-channels will be presented.This work was carried out in the framework of the projects: ADOPT No. SK-AT-20-0012, NOVASiN No. SK-AT-20-0017 and AUTOPIC No. APVV-17-0662 from Slovak research and development agency of Ministry of Education, Science, Research and Sport of the Slovak Republic and No. SK 07/2021 and SK 08/2021 from Austrian Agency for International Cooperation in Education and Research (OeAD-GmbH); and project PASTEL, no. 2020-10-15-001, funded by SAIA.
A Telecom optical fibers are still being the best transmission medium of digital data and analogue signals for long distance applications. Progress in integrated photonics enables development of photonic chips with new unique properties, circuits of the future, and overcomes current limits in information and communication technologies. The packaging of photonic chips is necessary for taking them out of research laboratories into real implementation in the information and communication technology applications. One important step of packaging is effective coupling of optical radiation between telecom optical fiber with ten microns core dimension and photonic chip optical waveguide with submicron dimensions. For complex photonic chips, it is necessary to couple not one optical fiber but several optical fibers, which are arranged in fiber arrays. In this case, it is necessary to use a 6D positioning system, which allows to optimally adjust the relative position of the photonic chip and the fiber arrays. After setting the optimal relative position of the photonic chip and the fiber array, the process of their fixation follows. One possibility of fixation is gluing with an adhesive in the optical path between the photonic chip and an array of optical fibers with a refractive index close to the refractive index of the optical fiber core. This paper is focused on the experimental test set-up for the temperature characterization of fiber array to photonics chip butt coupling at 1310 nm and 1550 nm wavelengths fixed themselves by UV adhesive in the optical path. The main aims of this works are selection of better adhesive from two types for gluing of photonic chip and fiber array in packaging process of photonics chips and validation of gluing process developing. The coupling and alignment of fiber arrays to photonics chip were done by automated active alignments system and they were fixed themselves by curable epoxy adhesive. Temperature changes of coupling insertion losses are measured and investigated for two different UV adhesives during three temperature cycles from -40 °C to 80 °C in climatic chamber according to Telcordia. Spectral dependence of insertion losses were measured and compared before and after three temperature cycles for 1530 nm to 1570 nm spectral range at room temperature.
This work was supported by the Slovak Research and Development Agency under the contracts APVV-17-0662 and SK-AT-20-0017 and by the COST Action “European Network for High Performance Integrated Microwave Photonics” (EUIMWP) CA16220.
