Ultrafast-laser dicing of thin silicon wafers: strategies to improve front- and backside breaking strength
Author: | Matthias Domke, Bernadette Egle, Sandra StrojORCiD, Marius Bodea, Elisabeth Schwarz, Gernot Fasching |
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DOI: | https://doi.org/10.1007/s00339-017-1374-7 |
Parent Title (English): | Applied Physics A |
Document Type: | Article |
Language: | English |
Year of publication: | 2017 |
Release Date: | 2020/03/06 |
Volume: | 123. Jg. |
Issue: | H. 12 |
Article Number: | 746 |
Number of pages: | 8 |
Organisationseinheit: | Forschung / Forschungszentrum Mikrotechnik |
Forschung / Josef Ressel Zentrum für Materialbearbeitung | |
DDC classes: | 600 Technik, Medizin, angewandte Wissenschaften |
Open Access?: | ja |
Peer review: | wiss. Beitrag, peer-reviewed |
Publicationlist: | Domke, Matthias |
Stroj, Sandra | |
Licence (German): | Creative Commons - CC BY - International - Attribution- Namensnennung 4.0 |