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Concept of PIC packaging with microwave, DC and fiber array ports

  • Progress in integrated photonics enables development of integrated photonics circuits with new unique properties, circuits of the future, and overcomes current limits in information and communication technologies. The packaging of photonic integrated circuits is necessary for taking them out of research laboratories into real implementation in the information and communication technology applications. Telecom optical fibers are still being the best transmission medium of digital data and analogue signals for long distance applications. The effective coupling of optical radiation between telecom optical fiber with ten microns core dimension and photonic integrated circuits optical waveguides with submicron dimensions are necessary. To address these challenges, we present our concept of photonics integrated circuit packaging with radio frequency, direct current and fiber array ports with automated active alignment system.

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Author:Jozef Chovan, Martin Tomaska, Frantisek Uherek, Daniel Hasko, Dana SeyringerORCiD, Lenka Gajdosova, Eduard Koza, Jozef Pavlov
Parent Title (English):2019 International Workshop on Fiber Optics in Access Networks (FOAN)
Document Type:Conference Proceeding
Year of publication:2019
Release Date:2019/12/10
Tag:concept; information and communication technology; integrated photonics; packaging; photonics integrated circuits
First Page:38
Last Page:41
Organisationseinheit:Forschung / Forschungszentrum Mikrotechnik
DDC classes:600 Technik, Medizin, angewandte Wissenschaften
Peer review:wiss. Beitrag, peer-reviewed
Publicationlist:Gajdosova, Lenka
Seyringer, Dana
Bibliographie 2019